Method for extracting copper and gold from waste mobile phone circuit board
A circuit board, mobile phone technology
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Embodiment 1
[0027] In nitric acid leaching copper step, adopt parameter: nitric acid concentration 4.5mol / L, reaction time 40min, reaction temperature 45 ℃, solid-liquid ratio (mass / volume) 1:15, stirring speed 400r / min, obtained 97.95% Copper leaching rate.
Embodiment 2
[0029] In nitric acid leaching copper step, adopt parameter: nitric acid concentration 5.5mol / L, reaction time 60min, reaction temperature 55 ℃, solid-liquid ratio (mass / volume) 1:25, stirring speed 400r / min, obtained 94.75% Copper leaching rate.
Embodiment 3
[0031] In thiourea leaching gold step, adopt parameter: thiourea concentration 9g / L, Fe 3+ The concentration was 4g / L, the reaction time was 45min, the reaction temperature was 30°C, the pH was 1.5, the stirring speed was 400r / min, and the solid-liquid ratio (mass / volume) was 1:20. The gold leaching rate was 95.88%.
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