Plasma treating apparatus for vapor phase etching and cleaning
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 俣愿技术
- Publication Date
- 2016-11-09
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Abstract
Description
technical field
[0001] The present invention relates to a plasma device for gas-phase etching and cleaning, and in more detail, relates to a device for selectively cleaning by directly using highly reactive atoms or molecules to directly react with a thin film on the surface of a target substrate Plasma units for vapor phase etching and cleaning. Background technique
[0002] Semiconductors are active electronic components with functions such as storage, amplification, and switching of electronic signals, and have high integration, high performance, and low power consumption. They are high value-added and leading digital informatization in the traction system industry and service industry Core components of the era.
[0003] The semiconductor manufacturing process can be roughly divided into the front process (wafer processing process) and the back process (assembly process and inspection process), and the front process equipment accounts for about 75% of the market share. ...