Heat radiation transfer line for detection of integrated circuit board

A technology of integrated circuit boards and conveyor lines, applied in circuits, conveyor objects, electrical components, etc., can solve the problems of long natural heat dissipation, affecting the efficiency of testing, etc., to improve testing efficiency, reduce cooling time, speed up cooling effect

Active Publication Date: 2016-11-09
GAOYOU DINGTIAN HIGH MOLECULAR MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The same integrated circuit involves multiple tests in the manufacturing process. Some integrated circuits need to be tested at different temperatures. When the temperature difference between two adjacent tests is large, the integrate

Method used

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  • Heat radiation transfer line for detection of integrated circuit board
  • Heat radiation transfer line for detection of integrated circuit board
  • Heat radiation transfer line for detection of integrated circuit board

Examples

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[0026] The specific implementation of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments, in which the direction of the arrow in the figure is the conveying direction of the integrated circuit board, the rotating direction of the roller shaft and the blowing direction of the cold wind. The following examples are used to illustrate the present invention, but not to limit the scope of the present invention.

[0027] See figure 1 , Figure 4 , The heat dissipation conveying line applied to the inspection of integrated circuit boards according to the present invention includes a frame 10 and a plurality of roller shafts 20 hinged on the frame, the frame 10 is located on both sides of the roller shaft 20, the roller The two ends of the shaft 20 are hinged on the bearing seat 21, the bearing seat is fixed on the frame 10, one end of the roller shaft 20 extends out of the bearing seat 21 and is fixedly connected wit...

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Abstract

The invention discloses a heat radiation transfer line for detection of integrated circuit boards. The heat radiation transfer line comprises a frame and a plurality of roll shafts hinged on the frame, and heat sinks are arranged under the roll shafts. Heat sinks comprises flow deflectors distributed between adjacent roll shafts, grooves are arranged in the upper ends of the flow deflectors, and rotating shafts are hinged to the sidewalls of the grooves. Blowing plates are fixedly inserted on the rotating shafts, blowing holes are formed in the blowing plates and wind passing holes communicating with the blowing holes are formed in the sidewalls of the rotating shafts. The rotating shafts are connected with an air cooler, and limiting plates are fixedly inserted on rotating shafts on one side of flow deflectors. Each limiting plate comprises an insertion portion inserted in the rotating shafts and a limiting portion vertically movably connected to one end of the insertion portion. An iron block is fixed on the end portion of the limiting potion, and a pair of limiting grooves are formed in the sidewalls of the grooves in two sides of each rotating shaft. Magnet pieces cooperating with the iron blocks are fixed in the limiting grooves. Accelerated heat radiation for integrated circuit board during a conveying process is ensured, thereby shortening cooling time and improving test efficiency.

Description

Technical field: [0001] The present invention relates to the technical field of integrated circuit testing equipment, in particular to a heat dissipation transmission line applied to the testing of integrated circuit boards. Background technique: [0002] Generally, a series of tests are required for the integrated circuit during the manufacturing process of the integrated circuit, and the integrated circuit that has failed early is removed from the production process as soon as possible to achieve the purpose of reducing the production cost. In order to imitate the use environment, it is usually necessary to heat the integrated circuit when testing the integrated circuit, and perform various tests on the integrated circuit in a high temperature environment. The same integrated circuit involves multiple tests in the manufacturing process. Some integrated circuits need to be tested at different temperatures. When the temperature difference between two adjacent tests is large, the ...

Claims

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Application Information

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IPC IPC(8): H01L21/66H01L21/67H01L21/677
CPCH01L21/67109H01L21/67706H01L22/10
Inventor 王文庆
Owner GAOYOU DINGTIAN HIGH MOLECULAR MATERIAL CO LTD
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