Heat radiation transfer line for detection of integrated circuit board

Abstract

The invention discloses a heat radiation transfer line for detection of integrated circuit boards. The heat radiation transfer line comprises a frame and a plurality of roll shafts hinged on the frame, and heat sinks are arranged under the roll shafts. Heat sinks comprises flow deflectors distributed between adjacent roll shafts, grooves are arranged in the upper ends of the flow deflectors, and rotating shafts are hinged to the sidewalls of the grooves. Blowing plates are fixedly inserted on the rotating shafts, blowing holes are formed in the blowing plates and wind passing holes communicating with the blowing holes are formed in the sidewalls of the rotating shafts. The rotating shafts are connected with an air cooler, and limiting plates are fixedly inserted on rotating shafts on one side of flow deflectors. Each limiting plate comprises an insertion portion inserted in the rotating shafts and a limiting portion vertically movably connected to one end of the insertion portion. An iron block is fixed on the end portion of the limiting potion, and a pair of limiting grooves are formed in the sidewalls of the grooves in two sides of each rotating shaft. Magnet pieces cooperating with the iron blocks are fixed in the limiting grooves. Accelerated heat radiation for integrated circuit board during a conveying process is ensured, thereby shortening cooling time and improving test efficiency.

Description

Technical field: [0001] The present invention relates to the technical field of integrated circuit testing equipment, in particular to a heat dissipation transmission line applied to the testing of integrated circuit boards. Background technique: [0002] Generally, a series of tests are required for the integrated circuit during the manufacturing process of the integrated circuit, and the integrated circuit that has failed early is removed from the production process as soon as possible to achieve the purpose of reducing the production cost. In order to imitate the use environment, it is usually necessary to heat the integrated circuit when testing the integrated circuit, and perform various tests on the integrated circuit in a high temperature environment. The same integrated circuit involves multiple tests in the manufacturing process. Some integrated circuits need to be tested at different temperatures. When the temperature difference between two adjacent tests is large, the ...

AI Technical Summary

Problems solved by technology

The same integrated circuit involves multiple tests in the manufacturing process. Some integrated circuits need to be tested at different temperatures. When the temperature difference between two adjacent tests is large, the integrated circuit needs to be cooled in the middle process. Heat dissipation, the existing method generally adopts natural cooling to dissipate heat, and the natural heat dissipation takes a long time, which affects the efficiency of the test

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