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Liquid-cooling VPX cabinet efficient heat-dissipation device and method based on vapor chamber

A heat dissipation device and heat dissipation method technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve problems such as leakage and limit heat dissipation of VPX board cards, and achieve improved heat dissipation capacity and small flow resistance , Improve the effect of heat dissipation performance

Active Publication Date: 2016-11-09
THE 724TH RES INST OF CHINA SHIPBUILDING IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first heat dissipation method limits the heat dissipation of the VPX board due to the thermal conductivity of the metal plate, and cannot effectively dissipate heat under high heat flux conditions
The second heat dissipation method distributes the coolant to each VPX board, so there is a possibility of leakage and safety

Method used

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  • Liquid-cooling VPX cabinet efficient heat-dissipation device and method based on vapor chamber
  • Liquid-cooling VPX cabinet efficient heat-dissipation device and method based on vapor chamber

Examples

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Embodiment Construction

[0016] The structure diagram of the high-efficiency heat dissipation device of the liquid-cooled VPX chassis based on the heat plate figure 1 . For the individual components of the VPX board, the heat flux density is 100-200W / cm 2 For applications where the heat dissipation requirement of a single VPX board card exceeds 100W, it is recommended to use a heat spreader to expand the heat of the VPX board and then dissipate it. The high-efficiency heat dissipation device for the liquid-cooled VPX subrack provided by the present invention includes a quick connector (1), a VPX board (2), an equalizing plate (4), an upper liquid cooling plate (5), a lower liquid cooling plate (6), and a lock Tensioner (7). Among them: the VPX board (2) is fastened to the soaking plate (4), and the heat source of the VPX board (2) contacts the surface of the soaking plate (4) to conduct heat to the soaking plate (4). The upper liquid-cooled cold plate (5) and the lower liquid-cooled cold plate (6) are...

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Abstract

The invention discloses a liquid-cooling VPX cabinet efficient heat-dissipation device and method based on a vapor chamber. The heat-dissipation device comprises the vapor chamber, upper and lower liquid cooling plates, lockers, a liquid cooling pipeline and connectors. Heat of VPX board cards is transmitted to the upper and lower liquid cooling plates arranged at the upper and lower positions of a VPX cabinet through the vapor chamber; the vapor chamber makes contact with the liquid cooling plates through the lockers, and a certain pressing force is generated; and through the contact surface, the heat is transmitted to the liquid cooling plates. According to the heat-dissipation method, the heat of the VPX board cards is transmitted to the liquid cooling plates through the vapor chamber, and the equivalent thermal conductivity of the vapor chamber reaches 2000 W / m.K. Through the efficient liquid cooling plates, the heat-dissipation capability of which reaches 30-100W / cm<2>, heat-dissipation requirements of the VPX board cards, the heat flux density of which is more than 100 W / cm<2> can be met.

Description

Technical field [0001] The invention adopts forced liquid cooling technology, liquid cooling cold plate technology and heat pipe technology to realize efficient heat dissipation of the VPX case. Background technique [0002] At present, the heat dissipation methods of VPX chassis mainly include forced air cooling and forced liquid cooling. The heat dissipation method of forced air cooling is to use a fan to perform forced convection on the air-cooled fins of the VPX board, and transfer the heat of the VPX board through the convection of the air and the fins. The heat dissipation capacity of the heat dissipation method is restricted by the heat transfer coefficient of the air flow and the heat exchange area, and the reliability of the fan and the environmental adaptability of the whole machine are also relatively limited. Forced air cooling is not suitable for heat dissipation under conditions with high environmental noise requirements. The VPX case that adopts forced liquid coo...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20254H05K7/20272
Inventor 唐文辉李维忠
Owner THE 724TH RES INST OF CHINA SHIPBUILDING IND
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