Surface treatment method of diamond micropowder for resin diamond wire saw

A technology of diamond micropowder and diamond wire saw, which is used in metal processing equipment, grinding devices, grinding/polishing equipment, etc., can solve the problem of low bonding strength between resin adhesive and diamond micropowder, affecting the cutting performance of resin diamond wire saw, etc. To solve the problem, to achieve the effect of strong diamond holding force, stable wire diameter and diamond number, and reducing the amount of addition

Inactive Publication Date: 2016-11-16
HENAN XINDAXIN SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the preparation of diamond micropowder, there are many defects on the surface of the micropowder, resulting in a low bonding strength between the resin binder and the diamond micropowder, which affects the cutting performance of the resin diamond wire saw.

Method used

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  • Surface treatment method of diamond micropowder for resin diamond wire saw
  • Surface treatment method of diamond micropowder for resin diamond wire saw

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Weigh methanol, KH-550, 50 g, 10 g, and 10 g of pure water in beakers at room temperature, and stir the mixture with a magnetic stirrer to fully react for 4 hours at a stirring speed of 600 rpm. After the treatment solution is prepared, put it aside for use.

[0023] Mix the above treatment liquid with 30 μm diamond micropowder and put it into the reaction kettle, the mass ratio of treatment liquid to diamond is 3:1. Set the stirring speed of the magnetic stirrer to 600 rpm, the reaction temperature to 50° C., and the reaction time to 2 hours.

Embodiment 2

[0025] Weigh ethanol, KH-560, 65g, 13g, and 13g of pure water in beakers at room temperature, and stir the mixture with a magnetic stirrer to fully react for 5 hours at a stirring speed of 700 rpm. After the treatment solution is prepared, put it aside for use.

[0026] Mix the above treatment liquid with 30 μm diamond micropowder and put it into the reaction kettle, the mass ratio of treatment liquid to diamond is 2.5:1. Set the stirring speed of the magnetic stirrer to 650 rpm, the reaction temperature to 55° C., and the reaction time to 2.5 hours.

Embodiment 3

[0028] Weigh 70g, 14g and 14g of isopropanol, KH-590, and pure water in beakers at room temperature, and stir the mixture with a magnetic stirrer to fully react for 6 hours at a stirring speed of 800 rpm. After the treatment solution is prepared, put it aside for use.

[0029] Mix the above treatment liquid with 30 μm diamond micropowder and put it into the reaction kettle, the mass ratio of treatment liquid to diamond is 4:1. Set the stirring speed of the magnetic stirrer to 600 rpm, the reaction temperature to 60° C., and the reaction time to 3 hours.

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Abstract

The invention belongs to the technical field of resin diamond wire saw production, and specifically relates to a method for surface treatment of diamond micropowder. The steps are as follows: take alcohol, silane coupling agent and pure water respectively according to the mass ratio of 3-8:1-3:1-3 and mixed, stirred at room temperature for 2-6 hours to obtain a treatment solution; the resulting treatment solution was mixed with the diamond micropowder in a mass ratio of 1 to 5:1, and stirred at 40-80°C for 2-6 hours; the stirred The speed is 800 rpm. The invention performs simple and high-efficiency surface treatment on the diamond micropowder to improve the bonding strength between the resin adhesive and the diamond micropowder.

Description

technical field [0001] The invention belongs to the technical field of resin diamond wire saw production, and in particular relates to a surface treatment method of diamond micropowder for resin diamond wire saw. Background technique [0002] Resin diamond wire saw is made by fixing diamond micropowder on the surface of metal wire through resin binder and curing it at high temperature. Compared with the traditional silicon carbide free abrasive, in the cutting of crystalline silicon wafers; the resin diamond wire saw has the characteristics of high slicing efficiency, small kerf, high slice rate, and good slice surface quality. At present, the application of resin diamond wire saw in the field of crystal silicon wafer cutting is becoming more and more extensive, and the traditional free mortar cutting technology will be gradually eliminated. [0003] The difficulty in the production of resin diamond wire saw is to improve the bonding strength of resin binder to diamond powd...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
CPCB24D18/0054
Inventor 孙毅杨梦洁阳辉辛玲申君来杨正宏张志刚陈亚丽徐元清
Owner HENAN XINDAXIN SCI & TECH
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