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Copper filling process for blind holes of circuit board

A circuit board and blind hole technology, which is applied in the direction of printed circuit, printed circuit manufacturing, and electrical connection formation of printed components, can solve the problems of poor copper uniformity, time-consuming and labor-consuming, and many processes on the PCB board, so as to reduce the production process , Reduce production costs and improve production efficiency

Inactive Publication Date: 2016-11-16
GUANGZHOU MEADVILLE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, during the generation process, the through holes and blind holes are made separately. This process requires many procedures, which is time-consuming and labor-intensive; and two times of copper immersion flash plating will lead to poor uniformity of copper on the PCB board after electroplating.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A process for filling copper in blind holes of a circuit board comprises the following five steps in sequence:

[0027] 1) Outer laminate; 2) Laser drilling to get blind holes; 3) Mechanical drilling to get through holes; 4) Immersion copper flash plating, copper immersion flash plating on blind holes and through holes; 5) VCP vertical filling Holes are used to fill blind holes after immersion copper flash plating.

[0028] Wherein, the production process of VCP vertical hole filling in step 5) is as follows in sequence: degreasing, first water washing, micro-etching, second water washing, acid leaching, copper plating hole filling, third water washing, pickling, fourth Wash and tumble dry once.

[0029] Specifically, in the degreasing step, the type of the degreasing agent is AL-Chelate, the temperature of the degreasing agent is controlled at 48°C, and soaked for 3 minutes. In the micro-etching step, the micro-etching liquid used comprises that concentration is 90g / ...

Embodiment 2

[0032] A process for filling copper in blind holes of a circuit board comprises the following five steps in sequence:

[0033] 1) Outer laminate; 2) Laser drilling to get blind holes; 3) Mechanical drilling to get through holes; 4) Immersion copper flash plating, copper immersion flash plating on blind holes and through holes; 5) VCP vertical filling Holes are used to fill blind holes after immersion copper flash plating.

[0034] Wherein, the production process of VCP vertical hole filling in step 5) is as follows in sequence: degreasing, first water washing, micro-etching, second water washing, acid leaching, copper plating hole filling, third water washing, pickling, fourth Wash and tumble dry once.

[0035] Specifically, in the degreasing step, the type of degreasing agent is AL-Chelate, the temperature of the degreasing agent is controlled at 50°C, and soaked for 4 minutes. In the micro-etching step, the micro-etching liquid used comprises that concentration is 70g / L so...

Embodiment 3

[0038] A process for filling copper in blind holes of a circuit board comprises the following five steps in sequence:

[0039] 1) Outer laminate; 2) Laser drilling to get blind holes; 3) Mechanical drilling to get through holes; 4) Immersion copper flash plating, copper immersion flash plating on blind holes and through holes; 5) VCP vertical filling Holes are used to fill blind holes after immersion copper flash plating.

[0040] Wherein, the production process of VCP vertical hole filling in step 5) is as follows in sequence: degreasing, first water washing, micro-etching, second water washing, acid leaching, copper plating hole filling, third water washing, pickling, fourth Wash and tumble dry once.

[0041] Specifically, in the degreasing step, the type of degreasing agent is AL-Chelate, the temperature of the degreasing agent is controlled at 52°C, and soaked for 5 minutes. In the micro-etching step, the micro-etching liquid used comprises that concentration is 80g / L so...

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PUM

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Abstract

The invention provides a copper filling process for blind holes of a circuit board. The copper filling process sequentially comprises the following steps of (1) outer-layer board lamination; (2) laser drilling to obtain the blind holes; (3) mechanical drilling to obtain through holes; (4) copper deposition flash plating: carrying out copper deposition flash plating on the blind holes and the through holes; and (5) vertical continuous electroplating (VCP vertical hole filling), carrying out hole filling on the blind holes after copper deposition flash plating. By the production technology, mixed plating of the through holes and the blind holes can be achieved, i.e., the production flow is optimized into mixed plating of the through holes and the blind holes, so that the production efficiency is improved; and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a process for filling copper in blind holes of circuit boards. Background technique [0002] Printed circuit board, referred to as PCB (printed circuit board), which uses an insulating board as the base material, cuts to a certain size, has at least one conductive pattern attached to it, and is equipped with holes (such as component holes, fastening holes, metallization holes, etc.) Holes, etc.), used to replace the chassis of the previous installation of electronic components, and to realize the interconnection between electronic components. Since such boards are made using electronic printing, they are called "printed" circuit boards. [0003] Vias are important elements in PCB boards, which can be used to electrically connect, fix or position devices. Vias can be divided into three categories: blind holes, buried holes, and through holes. Among them, the blind hole refer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/421
Inventor 罗郁新刘幸姬绍亮
Owner GUANGZHOU MEADVILLE ELECTRONICS
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