Thermal-conductive insulating soybean-based plate adhesive and preparation method thereof

A heat-conducting insulation and adhesive technology, applied in the direction of adhesives, adhesive additives, adhesive types, etc., can solve problems such as adhesive water resistance does not work, will endanger human health, and the product is not degradable. It is not easy to achieve Effects of equipment corrosion, low hydrophilicity, and water resistance improvement

Inactive Publication Date: 2016-12-07
QUANJIAO HAIFENG PRINTING PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Aldehyde adhesives are used in the largest amount in wood industry adhesives, but they have many disadvantages: the main raw materials are mostly from non-renewable resources such as petroleum and coal; carcinogens (such as formaldehyde) are continuously emitted during production and use, which will harm the human body Health...

Method used

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Embodiment Construction

[0023] A heat-conducting and insulating soybean-based substrate adhesive, which is composed of the following raw materials in parts by weight:

[0024] Butyltin trioctoate 0.6, aluminum nitride 0.1, lauryl dimethyl amine oxide 0.5, polyvinyl alcohol 2, defatted soybean powder 170, ferric chloride 0.3, ferrous chloride 0.1, epichlorohydrin 0.8, N methylol Acrylamide 2, styrene 16, potassium persulfate 0.1, hemicellulase 3, polydiphenylmethane diisocyanate 10, 20% hydrochloric acid solution 60, allyl polyethylene glycol 3, acetylated lanolin 0.7, Alkenyl succinic anhydride 2, microcrystalline paraffin 3, methyl cellulose 1, graphite powder 0.6.

[0025] A preparation method of the thermally conductive and insulating soybean-based substrate adhesive comprises the following steps:

[0026] (1) Mix the above-mentioned ferric chloride and ferrous chloride, add to 20% hydrochloric acid solution, stir evenly to obtain ferric salt solution;

[0027] (2) Add the above methyl cellulose...

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Abstract

The invention discloses a thermal-conductive insulating soybean-based plate adhesive which comprises the following raw materials in parts by weight: 0.6-1 part of butyltin trioctylate, 0.1-0.3 part of aluminum nitride, 0.5-1 part of lauryl dimethyl amine oxide, 2-4 parts of polyvinyl alcohol, 170-200 parts of defatted soybean powder, 0.3-0.4 part of ferric chloride, 0.1-0.2 part of ferrous chloride, 0.8-1 part of epichlorohydrin, 2-3 parts of N-hydroxymethyl acrylamide, 16-20 parts of styrene, 0.1-0.2 part of potassium persulfate, 3-4 parts of hemicellulase, 10-19 parts of polydiphenylmethane diisocyanate, 60-70 parts of 20-30 percent of hydrochloric acid solution, 3-4 parts of allyl polyethylene glycol, 0.7-1 part of acetylated lanolin, 2-3 parts of alkenyl succinic anhydride, 3-4 parts of microcrystalline wax, 1-2 parts of methylcellulose and 0.6-1 part of graphite powder. The thermal-conductive insulating soybean-based plate adhesive disclosed by the invention has the characteristics of being low in probability of equipment corrosion, free from formaldehyde, low in residual monomer content, friendly to environment, good in water resistance and the like.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a heat-conducting and insulating soybean substrate adhesive and a preparation method thereof. Background technique [0002] Aldehyde adhesives are used in the largest amount in wood industry adhesives, but they have many disadvantages: the main raw materials are mostly from non-renewable resources such as petroleum and coal; carcinogens (such as formaldehyde) are continuously emitted during production and use, which will harm the human body Healthy; the product is non-degradable and easy to pollute the environment. Therefore, the research and development of biomass-based adhesives to replace aldehyde-based adhesives has received global attention. Among various biomass materials, soybeans (including genetically modified soybeans) have the characteristics of large yield, low cost, and high plant protein content, and are good raw materials for adhesives; study soybean-based adhes...

Claims

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Application Information

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IPC IPC(8): C09J151/00C09J11/04C09J11/06C09J11/08C08F289/00C08F212/08C08H1/00
CPCC09J151/00C08F289/00C08H1/00C08L2205/035C09J11/04C09J11/06C09J11/08
Inventor 毕全中
Owner QUANJIAO HAIFENG PRINTING PACKAGING
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