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Adhesive sheet, dicing tape-integrated adhesive sheet, film, method for manufacturing semiconductor device, and semiconductor device

A bonding sheet, semiconductor technology, applied in the direction of semiconductor/solid device manufacturing, semiconductor device, film/sheet adhesive, etc., can solve the problem of large amount of silver paste protruding, hindering chip miniaturization, and silver paste spreading And other issues

Active Publication Date: 2021-05-04
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as chips continue to become thinner, the spread of silver paste to the chip surface is becoming more and more problematic
Also, since the amount of silver paste protruding is large, it hinders chip miniaturization
As such, there are various problems with silver paste

Method used

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  • Adhesive sheet, dicing tape-integrated adhesive sheet, film, method for manufacturing semiconductor device, and semiconductor device
  • Adhesive sheet, dicing tape-integrated adhesive sheet, film, method for manufacturing semiconductor device, and semiconductor device
  • Adhesive sheet, dicing tape-integrated adhesive sheet, film, method for manufacturing semiconductor device, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0076] (Film 1)

[0077] Such as figure 1 with figure 2 As shown, the film 1 includes a separator 13 and an adhesive sheet 11 arranged on the separator 13 . More specifically, the film 1 includes a separator 13 and dicing tape-integrated adhesive sheets 71 a , 71 b , 71 c , . The distance between the dicing tape-integrated adhesive sheet 71a and the dicing tape-integrated adhesive sheet 71b, the distance between the dicing tape-integrated adhesive sheet 71b and the dicing tape-integrated adhesive sheet 71c, ... the dicing tape-integrated adhesive sheet The distance between the adhesive sheet 71l and the dicing tape integrated adhesive sheet 71m is constant. The film 1 can be formed into a roll.

[0078] The dicing tape-integrated adhesive sheet 71 includes the dicing tape 12 and the adhesive sheet 11 arranged on the dicing tape 12 . The dicing tape 12 includes a base material 121 and an adhesive layer 122 arranged on the base material 121 . The adhesive sheet 11 can ha...

Deformed example 1

[0200] The contact portion 122A of the adhesive layer 122 has a property of being cured by radiation. The peripheral portion 122B of the adhesive layer 122 also has a property of being cured by radiation. In the manufacturing method of the semiconductor device, the chip 5 for die bonding is formed, the adhesive layer 122 is irradiated with ultraviolet rays, and the chip 5 for die bonding is picked up. Thereby, since the adhesive force of the adhesive layer 122 with respect to the chip|tip 5 for die bonding falls, it becomes possible to pick up the chip|tip 5 for die bonding easily.

Deformed example 2

[0202] The contact portion 122A of the adhesive layer 122 is cured by radiation. The peripheral portion 122B of the adhesive layer 122 is also cured by radiation.

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Abstract

The present invention relates to an adhesive sheet, a dicing tape-integrated adhesive sheet, a film, a method for manufacturing a semiconductor device, and a semiconductor device. An object of the present invention is to provide an adhesive sheet capable of efficiently releasing heat generated in a chip to a lead frame. Another object of the present invention is to provide a dicing tape-integrated adhesive sheet, a film, and the like including the adhesive sheet. The present invention relates to an adhesive sheet. When using the adhesive sheet of the present invention to form a device having a lead frame, an adhesive layer disposed on the lead frame, and a silicon chip disposed on the adhesive layer, the thermal resistance at the interface between the adhesive layer and the lead frame is 0.15K / W Below, the total thermal resistance is below 0.55K / W. The total thermal resistance is the sum of the interface thermal resistance and the internal thermal resistance of the adhesive layer.

Description

technical field [0001] The present invention relates to an adhesive sheet, a dicing tape-integrated adhesive sheet, a film, a method for manufacturing a semiconductor device, and a semiconductor device. Background technique [0002] Miniaturization of chips and miniaturization of wiring are in progress. However, the miniaturization of chips brings about a decrease in heat dissipation from the chip surface to the air layer. The miniaturization of wiring leads to an increase in the amount of heat generated by the chip. That is, by reducing the wiring width, the insulating layer between the wirings becomes smaller, the insulating properties are lowered, the leakage current is increased, and as a result, the amount of heat generated by the chip is increased. [0003] If the discharge generated from the chip is not released to the substrate, it may not be possible to maintain the function of the semiconductor. Under these circumstances, die attach materials with high thermal c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L21/6836H01L2221/68354H01L2221/68377H01L2924/181H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/00014H01L2924/00012H01L2924/00H01L23/49586H01L21/185H01L21/78H01L23/295H01L23/3737C09J7/20C09J11/04C09J113/00C09J163/00C09J2203/326
Inventor 木村雄大三隅贞仁高本尚英大西谦司宍户雄一郎
Owner NITTO DENKO CORP
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