Processing method for ultrathin multi-layer printed circuit board

Abstract

A processing method for an ultrathin multi-layer printed circuit board comprises the following steps of firstly, simultaneously laminating and pressing an ultrathin carrier copper foil and a carrier prepreg to form a detachable multi-layer structure circuit bard having a carrier structure, attaching and fixing the ultrathin copper foil onto the carrier structure by gummosis of carrier prepreg resin to form an unified integral structure, determining an alignment system by a positioning hole in the ultrathin carrier copper foil for subsequent flow process, and separating processing boards from the ultrathin copper foil and the carrier copper foil by edge milling and plate disassembly operation when the thicknesses of the processing boards are larger than or equal to 0.06 millimeters, thereby obtaining two completely same processing circuit boards; and finally, respectively processing the two processing boards by a conventional process flow until the fabrication of a required circuit or package substrate is completed. By the processing method, the cost can be substantially reduced, and the production efficiency and the product yield are improved.

Description

technical field [0001] The present invention relates to a printed circuit board or a semiconductor integrated circuit manufacturing technology, in particular to a processing method for an ultra-thin multilayer printed circuit board, and more particularly to an ultra-thin multilayer printed circuit board or a semiconductor integrated circuit with any layer interconnection The invention discloses a processing method of an ultra-thin multilayer printed circuit board in the process of manufacturing a package substrate. Background technique [0002] As electronic products enter the era of functionalization and intelligence, the development trend of high integration, miniaturization, and miniaturization is becoming more and more urgent. Printed circuit boards or semiconductor integrated circuit packaging substrates are the premise of satisfying the good electrical and thermal performance of electronic products. Under the current situation, it is also developing towards light, thin...

AI Technical Summary

Problems solved by technology

[0010] The key issue of this method is: the processing of inner core board

However, when the thickness of the dielectric layer of the core plate is less than 50 μm, special and expensive ultra-thin core plate processing equipment must be used for processing, and the production cost will increase significantly

The industry also uses auxiliary tools to proces

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