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Method for making leadless edge connector plate

A manufacturing method and technology of finger boards, which are applied in the manufacture of printed circuits, the reinforcement of conductive patterns, the formation of electrical connections of printed components, etc., can solve the problems of easy etching of normal lines, affect product quality, poor removal effect, etc., and achieve short production cycle , improve the pass rate, and easily remove the effect

Inactive Publication Date: 2016-12-14
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For this reason, the technical problem to be solved by the present invention is that the existing methods for removing gold finger wires have poor removal effect, are easy to remain, and are easy to etch normal circuits and affect product quality. Method for making lead gold finger board

Method used

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  • Method for making leadless edge connector plate

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Effect test

Embodiment

[0029] This embodiment provides a method for manufacturing a leadless gold finger board, which includes the following steps:

[0030] Pre-process: Cut a large sheet of incoming materials into plates of moderate size according to the design requirements of different plate numbers, remove the oxide film of oily substances on the surface of the plate by conventional methods, and perform chemical micro-etching to cause oxidation-reduction reactions on the copper surface. Roughen the copper surface.

[0031] S1, making the inner layer graphics, providing a cut and roughened inner layer core board, the inner layer core board has two positive and negative copper surfaces, and the front copper surface of the inner layer core board has an inner layer circuit area and Gold finger area of ​​the inner layer; making film, after making the required circuit pattern on the film sheet, laminating the dry film on the surface of the inner core board, reacting the photosensitive film in the dry f...

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Abstract

The invention discloses a method for making a leadless edge connector plate. In an outer figure manufacturing process, edge connector leads are not needed to be manufactured, a copper deposition layer is prepared on the surface of an outer copper foil by means of whole plate copper deposition, and an edge connector and an outer circuit figure area realize the conduction of currents through the copper deposition layer; the production process is simple and the production cycle is short; and besides, the copper deposition layer can be easily removed through a micro-etching method, the copper deposition layer can be thoroughly removed and no copper layer residual exists, so that the problems in the prior art that the edge connector leads cannot be removed completely and are easily remained can be solved, and the micro-etching method does not damage a normal circuit, thus the problem that circuits of a traditional leadless edge connector plate are bitted and corroded due to weak filming can be solved, and the qualified rate of products can be improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production and manufacture, and relates to a method for manufacturing a golden finger, in particular to a method for manufacturing a leadless golden finger board. Background technique [0002] Gold finger (edge ​​connector) is a common structure on printed circuit boards. It is usually set on the edge of the printed circuit board outside the circuit area. It is a metal contact piece obtained by electroplating a layer of nickel gold on the copper pad. The metal contacts are rectangular and arranged in a row on the edge of the board. The back end of the contact is usually provided with a gold finger wire to connect with the line area. The function of the gold finger is mainly used as an outlet for the external connection of the circuit board. The immersion gold has superior conductivity and oxidation resistance, and nickel-gold electroplating on the surface of the gold surface can ensu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/24
CPCH05K3/403H05K3/24H05K3/4076H05K2203/0723
Inventor 周文涛彭卫红喻恩
Owner SHENZHEN SUNTAK MULTILAYER PCB
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