Turning method for tungsten-titanium target

Abstract

Disclosed is a turning method for a tungsten-titanium target. The turning method comprises the steps that the tungsten-titanium target and a back plate are provided; the tungsten-titanium target and the back plate are welded together to form a tungsten-titanium target assembly; a first tool is adopted for conducting first turning on the tungsten-titanium target in the tungsten-titanium target assembly, and the included angle of the cutting edge of the first tool is 80 degrees; after first turning, the back plate of the tungsten-titanium target assembly is machined; and after the back plate of the tungsten-titanium target assembly is machined, a second tool is adopted for conducting second turning on a blank of the tungsten-titanium target, and the included angle of the cutting edge of the second tool is 35 degrees-55 degrees. Through the turning method, the quality of the formed tungsten-titanium target can be improved, and abrasion of the tools is slowed down.

Description

technical field [0001] The invention relates to the technical field of targets, in particular to a turning method of a tungsten-titanium target. Background technique [0002] Magnetron sputtering is a substrate coating process that uses charged particles to bombard the target, so that the target atoms escape from the surface and are evenly deposited on the substrate. Magnetron sputtering has become the most excellent substrate coating process due to its advantages of high sputtering rate, low substrate temperature rise, good film-substrate bonding force, and excellent metal coating uniformity and strong controllability. It is widely used in the coating process of electronic and information industries such as integrated circuits, information storage, liquid crystal display, laser memory, electronic control devices, etc. With the rapid development of the electronic information industry, such as in the manufacturing process of integrated circuits, the size of the chip substrat...

AI Technical Summary

Problems solved by technology

[0005] In the process of processing tungsten-titanium target by turning processing method, if the processing parameters are selected unreasonably, it will cause chipping of the corners of the product, and problems such as cracking of the tool or sparks during processing

Moreover, due to the high hardness of the processed material, the processing tool wears quickly. During the turning process, once the tool is worn, it will in turn cause chipping of the edges and corners of the product, which cannot meet the requirements of the finished target material.

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