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A kind of rfi molding resin film encapsulation and air path setting method

A technology of resin film and gas path, which is applied in the field of liquid molding of resin-based composite materials, can solve problems affecting the quality of the outer surface of the wallboard, and achieve the effect of avoiding the accumulation of resin residues, avoiding dry spots, and ensuring flatness

Active Publication Date: 2018-10-12
AVIC COMPOSITES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of infiltration method, because the resin film is placed between the bottom mold and the preform, affects the quality of the outer surface of the wall panel

Method used

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  • A kind of rfi molding resin film encapsulation and air path setting method
  • A kind of rfi molding resin film encapsulation and air path setting method
  • A kind of rfi molding resin film encapsulation and air path setting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Example 1: figure 2 Shown is a panel structure with hat ribs, where the hat ribs and skin are integrally formed by the RFI process. For the molding of this structure, resin penetration is required in the flange area of ​​the hat rib. In order to achieve resin penetration and ensure the quality of the outer surface of the wall panel, the resin film packaging method and air path setting method proposed in this plan are adopted, as follows:

[0048] (a) The dry fiber area of ​​the preform 1 that needs to be permeated with resin is the hat rib flange area and the R angle area at the root. The resin film laying area is selected according to the contour edge line of the hat rib flange area, and the distance from the contour edge line The outward offset is 0-30mm, and the inner R-angle area is offset outward by 0-5mm according to the upper tangent of the R-angle.

[0049](b) Punch holes in the hat rib mold corresponding to the resin film laying area of ​​the inner mold 3 of ...

Embodiment 2

[0059] Example 2: Figure 4 The stiffened siding structure shown, with stiffening and skin integrally formed by the RFI process. For the molding of this structure, resin infiltration is required in the skin area. In order to ensure the quality of the exterior surface of the wall panel, the resin film packaging method and air path setting method of this scheme are adopted, as follows:

[0060] (a) The resin film laying area of ​​the preform 1 is the skin area. In order to avoid package bridging, the edge of the package in the R corner area is selected to be offset inward by 0-5mm from the tangent line on the R corner.

[0061] (b) Drill holes in the skin areas of the molds 3-1 and 3-2 inside the wall panels. The edge of the punched area is offset inwardly from the edge of the resin film laying area by 5 mm to 10 mm, the hole diameter does not exceed φ2 mm, and the hole spacing is 15 mm. After the mold preparation is completed, it is assembled with the preform.

[0062] (c) Ai...

Embodiment 3

[0071] Embodiment 3: The skin of the wall panel with a sunken area on the outer surface is formed by the RFI process. The skin area needs to be permeated with resin. In order to ensure the quality of the external surface of the wall panel, the resin film is laid on the inner side of the wall panel. The resin film packaging method and air path setting method of this plan are adopted, as follows:

[0072] (a) The dry fiber area of ​​the preform that needs to be resin-infiltrated is the wall panel skin area, and the resin film laying area is according to the edge line of the skin contour.

[0073] (b) Holes are drilled on the mold 3 inside the wall panel, and the edge of the punched area is offset inwardly from the edge of the resin film laying area by 5 mm to 10 mm, the hole diameter does not exceed φ2 mm, and the hole spacing is 15 mm. After the mold preparation is completed, it is assembled with the preform.

[0074] (c) Air path is designed between the external surface of th...

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Abstract

The invention belongs to a resin-based composite liquid molding technique, relates to a resin film encapsulating and gas channel arranging method in RFI molding, and provides a gas channel arranging and resin film encapsulating method for an improved RFI technology. According to the method, in an area, needing resin infusion, of a wallboard, a resin film is encapsulated on the surface of a mold on the inner side of the wallboard by adopting an adhesive guide material, sealing strips and an isolating film; by arranging a gas channel between a wallboard preform and the mold to guide resin to permeate from top to bottom, complete wetting of the resin on the preform is achieved, and dry spots are avoided; good matching can be achieved when the wallboard preform and the mold are assembled, wallboard preform fiber deformation caused by resin flow in the resin laying and transferring process is avoided, and complete wetting of the resin on the preform is achieved on the premise of ensuring the quality of the inner surface and the outer surface of the wallboard.

Description

technical field [0001] The invention belongs to the liquid molding technology of resin-based composite materials, and relates to an RFI molding resin film packaging and gas path setting method. Background technique [0002] The resin film infiltration (Resin Film Infusion, RFI for short) molding technology of composite materials is to use dry fibers to prepare fiber preforms. During the mold assembly process, the resin film and dry fiber preforms are packaged together. The resin is melted, and under the action of vacuum and pressure, the resin flows to complete the infiltration of the fibers of the preform, and the composite material is obtained by heating and curing. The encapsulation of the resin film and the air path setting are the key links in the RFI process. [0003] The traditional resin film infiltration molding method for composite materials is to prepare the required resin into a resin film and place it at the bottom of the cavity between the preform and the mold...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/48B29C70/44
CPCB29C70/443B29C70/446B29C70/462B29C70/48
Inventor 高艳秋王海雷
Owner AVIC COMPOSITES
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