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Preparation method of copper foil electricity-conducting, heat-conducting, anti-shock and shielding adhesive tape

A technology of electrical conduction, heat conduction, and copper foil, which is applied in the direction of conductive adhesives, chemical instruments and methods, adhesives, etc., can solve the problem of lack of electrical conduction, heat conduction, shock resistance, shielding functions, unsatisfactory use of conductive tape, and affect the performance of electronic products And other problems, to achieve good conductive effect, simple structure, good viscosity effect

Inactive Publication Date: 2017-01-04
斯迪克新型材料(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of society, various adhesive tapes have become indispensable items in the electronics industry; in the electronic product industry such as mobile phones, notebook computers, tablet computers, and digital cameras, they can be used for fixing flexible circuits and frames. However, Ordinary adhesive tape is often used, which does not have the functions of electric conduction, heat conduction, shock resistance, and shielding, which affects the performance of electronic products
[0003] The conductive and thermally conductive tapes used in the market are generally made of conductive and thermally conductive substrates coated with conductive and thermally conductive adhesives. The use effect of the prepared conductive tape is not satisfactory; the foam used in the anti-seismic tape is relatively soft, and its tensile performance is very poor. Die-cutting and punching are easy to deform and cause dimensional changes during use.
[0004] These tape products have single performance and cannot meet the needs of the rapid development of the electronics industry. Therefore, it is necessary to develop a copper foil conductive, thermal conductive, shock-resistant, and shielding tape.

Method used

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  • Preparation method of copper foil electricity-conducting, heat-conducting, anti-shock and shielding adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] refer to figure 1 , the present embodiment proposes a method for preparing a copper foil conductive, thermally conductive, shock-resistant, and shielding adhesive tape, comprising the following steps:

[0020] S1: the substrate layer 3 is made of copper foil;

[0021] S2: Mix 20 parts by weight of nano-scale metal powder and 10 parts by weight of nano-scale graphite powder, then add 40 parts by weight of toluene, stir for 5 minutes, add 10wt% conductive heat transfer fluid, and stir for 15 minutes to obtain Conductive heat conduction glue;

[0022] S3: Use a release material to prepare the release material layer 1, use a coating machine to coat the conductive heat-conducting adhesive on the release material layer 1, and then cure it in an oven at 80°C for 5 minutes, and the conductive heat-conducting adhesive is cured into a conductive heat-conducting adhesive Layer 2, and then transferred to both sides of the base material layer 3, making a copper foil double-sided a...

Embodiment 2

[0025] refer to figure 1 , the present embodiment proposes a method for preparing a copper foil conductive, thermally conductive, shock-resistant, and shielding adhesive tape, comprising the following steps:

[0026] S1: the substrate layer 3 is made of copper foil;

[0027] S2: Mix 25 parts by weight of nanoscale metal powder and 13 parts by weight of nanoscale graphite powder, then add 50 parts by weight of toluene, stir for 8 minutes, add 13wt% conductive heat transfer fluid, and stir for 18 minutes to obtain Conductive heat conduction glue;

[0028] S3: Use a release material to prepare the release material layer 1, use a coating machine to coat the conductive and heat-conducting adhesive on the release material layer 1, and then cure it in an oven at 90°C for 8 minutes, and the conductive and heat-conducting adhesive will be cured into a conductive and heat-conducting adhesive Layer 2, and then transferred to both sides of the base material layer 3, making a copper foil...

Embodiment 3

[0031] refer to figure 1 , the present embodiment proposes a method for preparing a copper foil conductive, thermally conductive, shock-resistant, and shielding adhesive tape, comprising the following steps:

[0032] S1: the substrate layer 3 is made of copper foil;

[0033] S2: Mix 30 parts by weight of nano-scale metal powder and 15 parts by weight of nano-scale graphite powder, then add 60 parts by weight of toluene, stir for 10 minutes, add 15wt% conductive heat transfer fluid, and stir for 20 minutes to obtain Conductive heat conduction glue;

[0034] S3: Use a release material to prepare the release material layer 1, use a coating machine to coat the conductive and heat-conducting adhesive on the release material layer 1, and then cure it in an oven at 100°C for 10 minutes, and the conductive and heat-conducting adhesive is cured into a conductive and heat-conducting adhesive Layer 2, and then transferred to both sides of the base material layer 3, making a copper foil...

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Abstract

The invention discloses a preparation method of copper foil electricity-conducting, heat-conducting, anti-shock and shielding adhesive tape. The preparation method includes the following steps that S1, copper foil is selected and prepared into a base material layer; S2, 20-30 parts by weight of nano-scale metal powder and 10-15 parts by weight of nano-scale graphite powder are mixed, then 40-60 parts by weight of methylbenzene is added, after the materials are stirred for 5-10 min, 10 wt% to 15 wt% of electricity-conducting and heat-conducting liquid is added, the materials are stirred for 15-20 min, and an electricity-conducting and heat-conducting adhesive is prepared; S3, a release material is selected and prepared into a release material layer, the release material layer is coated with the electricity-conducting and heat-conducting adhesive through a coating machine, then the release material layer is cured in an oven at the temperature of 80-100 DEG C for 5-10 min, the electricity-conducting and heat-conducting adhesive is cured into electricity-conducting and heat-conducting adhesive layers, the electricity-conducting and heat-conducting adhesive layers are transferred to the two faces of the base material layer, and the copper coil double-faced adhesive tape with the two sides provided with the release material layers is prepared. The structure is simple, an omni-bearing electricity-heating sponge layer and the electricity-conducting and heat-conducting adhesive layers are arranged, and the electricity-conducting, heat-conducting, anti-shock and shielding effects can be achieved.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to a method for preparing a copper foil conductive, thermally conductive, shock-resistant and shielding adhesive tape. Background technique [0002] With the rapid development of society, various adhesive tapes have become indispensable items in the electronics industry; in the electronic product industry such as mobile phones, notebook computers, tablet computers, and digital cameras, they can be used for fixing flexible circuits and frames. However, Ordinary adhesive tape is often used, which does not have the functions of electric conduction, heat conduction, shock resistance, and shielding, which affects the performance of electronic products. [0003] The conductive and thermally conductive tapes used in the market are generally made of conductive and thermally conductive substrates coated with conductive and thermally conductive adhesives. The use effect of the prepare...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B5/18B32B15/20B32B15/04B32B15/12B32B33/00B32B37/12B32B37/26C09J133/12C09J9/02C09J11/04C09J7/02
CPCB32B5/18B32B15/04B32B15/046B32B15/12B32B15/20B32B33/00B32B37/1284B32B37/26B32B2037/268B32B2255/26B32B2307/202B32B2307/302B32B2307/56C08K3/04C08K3/08C08K2201/011C09J7/28C09J7/385C09J9/02C09J11/04C09J133/12
Inventor 金闯朱先磊葛志远曹闯王星
Owner 斯迪克新型材料(江苏)有限公司
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