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Heat-sealable high-barrier packaging film

A packaging film and high-barrier technology, applied in the field of heat-sealable high-barrier packaging film, can solve the problems of high crystallinity, high melting point, and limited use of packaging materials, so as to improve surface smoothness, reduce costs, and improve barrier self-extinguishing effect

Active Publication Date: 2017-01-04
SUZHOU KECHUANG ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although PET itself has high barrier properties to water, oxygen and carbon dioxide gas, but for some occasions with special requirements on barrier properties, such as tomato products, cooked products sensitive to trace oxygen, etc., only PET is used as packaging material can not meet the requirements
[0003] As a packaging material, heat-sealability is a basic property. Because the molecular chain itself of PET is rigid, and the heat setting in the production process makes its crystallinity high, resulting in a relatively high melting point. Therefore, PET film itself cannot be heat-sealed. Combined, it largely limits the use of packaging materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Heat-sealable high barrier packaging film processing technology:

[0026] The PET slices and inorganic particles, PETG and PET blended slices, the two mixed thermal resin materials are dried by the blower dryer respectively, and then three corresponding twin-screw extruders are respectively used to pass through the three-layer co-extrusion die. Extrusion, followed by filtration, casting, longitudinal stretching, online coating, transverse stretching, traction winding, and slitting to obtain a heat-sealable high-barrier packaging film.

[0027] The composition of each component of Table 1 Embodiment 1~7

[0028]

[0029]

[0030] As shown in Table 2, the above embodiments were tested, the test content is as follows, and the test results are shown in Table 2.

[0031] 1. Tensile test (tensile strength)

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PUM

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Abstract

The invention discloses a heat-sealable high-barrier packaging film. The heat-sealable high-barrier packaging film is of an A, B and C type three-layer composite structure, wherein the A layer is a PETT / PETG polyester layer, the B layer is made of two thermoplastic resin materials through a co-extrusion process, and the C layer comprises PET chips and inorganic particles. The packaging film has a good barrier property and can be directly heat-sealed. The three-layer heat-sealable high-barrier packaging film is compact in structure, and the barrier property of the packaging film can be substantially improved; besides, the packaging film can be heat-sealed, is safe and nontoxic and can be applied to the food packaging industry.

Description

technical field [0001] The invention belongs to the field of packaging films, in particular to a heat-sealable and high-barrier packaging film. Background technique [0002] PET has become a widely used packaging material due to its advantages such as convenient molding and processing, excellent comprehensive mechanical properties, and low price. Although PET itself has high barrier properties to water, oxygen and carbon dioxide gas, but for some occasions with special requirements on barrier properties, such as tomato products, cooked products sensitive to trace oxygen, etc., only PET is used as packaging material The requirements cannot be met. [0003] As a packaging material, heat-sealability is a basic property. Because the molecular chain itself of PET is rigid, and the heat setting in the production process makes its crystallinity high, resulting in a relatively high melting point. Therefore, PET film itself cannot be heat-sealed. Combined, the use of packaging mate...

Claims

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Application Information

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IPC IPC(8): C08L67/02C08L23/06C08L69/00C08L59/00C08K3/34C08K3/36C08K5/098B32B27/36B32B27/32B32B27/08B65D65/40
CPCB32B27/08B32B27/32B32B27/322B32B27/36B32B27/365B65D65/40C08K3/346C08K3/36C08K5/098C08K2201/003C08K2201/011C08L23/06C08L59/00C08L67/02C08L69/00C08L2201/02C08L2203/16C08L2205/025
Inventor 李彦
Owner SUZHOU KECHUANG ELECTRONICS MATERIAL CO LTD
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