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Temperature control coating with high heat conduction property and preparation method thereof

A technology of thermal conductivity and coating, applied in the field of thermal control methods to enhance thermal conductivity, can solve the problems of lack of thermal conductivity materials and low thermal conductivity, and achieve the effect of reducing system weight, high operability, and convenient maintenance performance.

Inactive Publication Date: 2017-01-04
SHANGHAI YUDA IND
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Most of the existing coatings are based on organic polymer materials, and the thermal conductivity of organic polymer materials is very small, generally not exceeding 1W / (m K), and does not have the properties of excellent thermal conductivity materials

Method used

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  • Temperature control coating with high heat conduction property and preparation method thereof

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Embodiment 1

[0033] This embodiment relates to a method for preparing a temperature-controlled coating with strong thermal conductivity, comprising the following steps:

[0034] (1) Preparation of paint coating Raw material preparation: raw materials include 107 room temperature vulcanized silicone rubber, thermally conductive filler particles, KH550 surface treatment agent, and xylene (thinner) as an auxiliary material.

[0035] (2) The composition of typical thermally conductive filler particles is as follows:

[0036] 1) Conductive heat-conducting filler particles: based on 100 parts of 107 RTV silicone rubber, 40 parts of 1000-mesh spherical graphite and 20 parts of 80-mesh flake graphite are required.

[0037] 2) Insulating thermally conductive filler particles: based on 100 parts of 107 room temperature vulcanized silicone rubber, 60 parts of cubic boron nitride of 500 mesh or more are required.

[0038] (3) Typical coating preparation steps are as follows:

[0039] 1) In a 1000ml ...

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Abstract

The invention provides a temperature control coating with a high heat conduction property and a preparation method thereof. The temperature control coating comprises a paint layer and heat conduction particles doped in the paint layer. The preparation method of the temperature control coating includes the following steps that coating paint is prepared; 5 parts of a surface treatment agent is added into every 100 parts of the coating paint 10 min before spraying or brushing, spraying or brushing is carried out after the surface treatment agent and the coating paint are stirred evenly, standing is carried out for 72 h under the room-temperature ventilation condition for primary curing, and the temperature control coating is formed one week later. By adding the heat conduction filler in the paint, the heat conduction property of the coating is improved, and heat diffusion on the surface of a product is achieved through the coating; by adopting the novel additive with a high heat conduction property, the heat conduction property of the coating is substantially improved, relatively centralized heat is effectively diffused along the surface of the coating, and the temperature control capability is further improved.

Description

technical field [0001] The invention relates to a heat control method for enhancing heat conduction, which is realized by adding particles with high heat conduction performance inside the coating. Background technique [0002] The current development of new industries and new technologies represented by the aerospace and electronics industries has higher and higher requirements for thermal control. In the application of many new devices, heat dissipation will be an important technical issue that determines whether they can function normally. Existing thermal control means are realized through thermal control products, and thermal control products involving device level need to be miniaturized. Therefore, it is urgent to expand the heat dissipation means to adapt to the thermal control problem of irregular surfaces. [0003] Most of the existing coatings are based on organic polymer materials, and the thermal conductivity of organic polymer materials is very small, generally ...

Claims

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Application Information

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IPC IPC(8): C09D183/04C09D183/06C09D7/12
CPCC09D183/04C08K3/04C08K3/38C08K7/00C08K7/18C08K2003/385C09D183/06
Inventor 季琨孙敬文齐晓军陈延龙彭聪刘纯泽张之毅
Owner SHANGHAI YUDA IND
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