Preparation method of mold-pressing-resistant dipping silver paste

Abstract

The invention discloses a preparation method of mold-pressing-resistant dipping silver paste. The method comprises the following steps: (1) sufficiently dissolving a 1-20% thermoplastic resin in a certain amount of organic solvent to prepare a resin solution; (2) proportionally adding a thermosetting resin monomer and a curing agent into the resin solution in the step (1), and sufficiently stirring uniformly to prepare an organic carrier; and (3) mixing the organic carrier obtained in the step (2) and silver powder according to the mass ratio of 1:1, and uniformly dispersing by ball milling. The method is simple and feasible in reaction steps, and is suitable for large-scale mass production. Besides, the mold-pressing-resistant dipping silver paste has the advantages of low volume resistivity, favorable high-temperature adhesion, no sagging and excellent high-temperature mold pressing resistance.

Description

technical field [0001] The invention relates to the field of microelectronic electrode materials, in particular to a method for preparing mold-resistant dipping silver paste. Background technique [0002] Immersion silver paste, as a low-temperature curing silver paste, has been widely used as electrode lead paste on tantalum capacitors and aluminum electrolytic capacitors. Compared with high-temperature sintered silver paste, it has a lower service temperature (120°C-250°C), and the process is simple and easy, so it is widely used in the electrode leads of components. [0003] Impregnated silver paste is generally composed of resin materials, conductive fillers, organic solvents, etc. It needs to have good conductivity and very good bonding strength when used as an electrode lead-out. On some electronic components that require high-temperature molding and plastic sealing, the high-temperature adhesion of the impregnated silver paste film layer will also become a very impor...

AI Technical Summary

Problems solved by technology

For impregnating silver paste, there are a large number of documents and patent reports at home and abroad, most of which use a single resin as the adhesive for impregnating the silver paste film layer in the selection of resin materials, such as Chinese patent 200310117092.3 introduces a high The thermosetting conductive silver paste with adhesive strength has excellent adhesion but high volume resistivity, while Chinese patent 200610051243.3 introduces an impregnated silver paste using thermoplastic acrylic resin as adhesive, which has low volume resistivity but high temperature adhesion Difference

Immersion silver paste that satisfies the two conditions of excellent high-temperature adhesion and low volume resistivity has not been reported yet.