Room-temperature cured flexible epoxy adhesive and preparation method thereof

An epoxy adhesive, curing technology at room temperature, applied in the direction of epoxy resin glue, adhesive, adhesive additives, etc., to achieve the effect of insensitivity to interface moisture and dust, high bonding strength, and good heat resistance

Active Publication Date: 2017-01-04
武汉拓路特铺技术工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, bridge waterproof bonding, road anti-slip coatings and building waterproof construction are generally carried out outdoors at room temperature or even low temperature, which requires epoxy resin adhesives to be able to quickly gel and solidify at room temperature. There are contradictions in the flexibility of epoxy, and it is difficult to have both

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The preparation method of normal temperature curing flexible epoxy adhesive, it comprises the steps:

[0043] 1) Preparation of component A modified epoxy resin:

[0044] ①According to each component and its parts by weight: 100 parts of bisphenol A epoxy resin, 6 parts of bisphenol F epoxy resin, 1 part of 1,4-butanediol diglycidyl ether, 1 part of nonylphenol NP 5 copies;

[0045] ② Weigh bisphenol A type epoxy resin, bisphenol F type epoxy resin and 1,4-butanediol diglycidyl ether in parts by weight, pour into a stirring tank and stir at room temperature for 20-25 minutes to form epoxy resin For the resin mixture, the stirring speed is controlled within the range of 100r / min to 400r / min.

[0046] ③ Pour nonylphenol NP into the pre-stirred epoxy resin mixture, and continue to stir in the stirring tank at room temperature for 10-15 minutes to form A-component modified epoxy resin.

[0047] 2) Prepare B component epoxy curing agent:

[0048] ①According to the compon...

Embodiment 2

[0060] The preparation method of normal temperature curing flexible epoxy adhesive, it comprises the steps:

[0061] 1) Preparation of component A modified epoxy resin:

[0062] ①According to each component and its parts by weight: 100 parts of bisphenol A type epoxy resin, 1 part of bisphenol F type epoxy resin, 10 parts of 1,4-butanediol diglycidyl ether, 10 parts of nonylphenol NP 7 servings.

[0063] ② Weigh bisphenol A type epoxy resin, bisphenol F type epoxy resin and 1,4-butanediol diglycidyl ether in parts by weight, pour into a stirring tank and stir at room temperature for 20-25 minutes to form epoxy resin For the resin mixture, the stirring speed is controlled within the range of 100r / min to 400r / min.

[0064] ③ Pour nonylphenol NP into the pre-stirred epoxy resin mixture, and continue to stir in the stirring tank at room temperature for 10-15 minutes to form A-component modified epoxy resin.

[0065] 2) Prepare B component epoxy curing agent:

[0066] ①Accordin...

Embodiment 3

[0078] The preparation method of normal temperature curing flexible epoxy adhesive, it comprises the steps:

[0079] 1) Preparation of component A modified epoxy resin:

[0080] ①According to the components and their parts by weight: 100 parts of bisphenol A type epoxy resin, 5 parts of bisphenol F type epoxy resin, 20 parts of 1,4-butanediol diglycidyl ether, 20 parts of nonylphenol NP 5.5 servings.

[0081] ② Weigh bisphenol A type epoxy resin, bisphenol F type epoxy resin and 1,4-butanediol diglycidyl ether in parts by weight, pour into a stirring tank and stir at room temperature for 20-25 minutes to form epoxy resin For the resin mixture, the stirring speed is controlled within the range of 100r / min to 400r / min.

[0082] ③ Pour nonylphenol NP into the pre-stirred epoxy resin mixture, and continue to stir in the stirring tank at room temperature for 10-15 minutes to form A-component modified epoxy resin.

[0083] 2) Prepare B component epoxy curing agent:

[0084] ①Acc...

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Abstract

The invention relates to a room-temperature cured flexible epoxy adhesive and a preparation method thereof. The room-temperature cured flexible epoxy adhesive is characterized by being prepared from a component A epoxy resin and a component B epoxy curing agent; in a utilization process, the component A epoxy resin and the component B epoxy curing agent are selected at the weight ratio of the component A epoxy resin to the component B epoxy curing agent of (1.15 to 1.20) to 1; after the component A epoxy resin and the component B epoxy curing agent are sufficiently mixed, the room-temperature cured flexible epoxy adhesive is obtained, wherein the component A epoxy resin is prepared from the following components in parts by weight: 100.5 to 115 parts of epoxy resin, 0.5 to 20 parts of a reactive diluent and 0.5 to 20 parts of an epoxy accelerant; the component B epoxy curing agent is prepared from the following components in parts by weight: 5 to 15 parts of an alicyclic amines curing agent, 28 to 100 parts of a polyether amines curing agent, 10 to 80 parts of a curing accelerant and 0.5 to 2 parts of a bonding accelerant. The adhesive prepared by the method can be cured at room temperature, is high in bonding strength and good in low-temperature flexibility, and can be used for elastic bonding.

Description

technical field [0001] The invention relates to a normal-temperature curing flexible epoxy adhesive and a preparation method thereof, which are widely used in waterproof bonding of bridges, anti-skid coatings for roads and waterproofing of buildings. Background technique [0002] Traditional room temperature curing epoxy resin adhesives usually have a high crosslinking density, resulting in brittle texture, insufficient toughness, and poor elasticity. In terms of mechanical properties, the main performance is high tensile strength and low elongation at break. , and no fatigue resistance at all. Therefore, most room temperature curing epoxy adhesives are mainly used in structural adhesives, potting adhesives, planting adhesives and anti-corrosion coatings in the fields of roads, bridges and construction engineering. Roads and bridges are subject to repeated traffic loads during actual use, and at the same time temperature changes will also cause temperature stresses due to i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C08G59/50
CPCC08G59/5026C08G59/504C08L2201/08C09J11/06C09J163/00C08L63/00C08K5/544
Inventor 王凯磨炼同史乐吴少鹏肖月刘刚余剑英
Owner 武汉拓路特铺技术工程有限公司
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