Film packaging structure, preparation method and organic light emitting apparatus with same

A thin-film encapsulation and thin-film technology, which is used in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve the problems of poor water and oxygen barrier properties and unsatisfactory flexibility, and achieve good water and oxygen barrier properties, suitable for The effect of mass production and easy packaging process

Inactive Publication Date: 2017-01-04
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing inorganic layer thin film packaging structure has good water and oxygen barrier performance, but the flexibility is not ideal; and the film with good flexibility has poor water and oxygen barrier performance, such as polymer film

Method used

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  • Film packaging structure, preparation method and organic light emitting apparatus with same
  • Film packaging structure, preparation method and organic light emitting apparatus with same
  • Film packaging structure, preparation method and organic light emitting apparatus with same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0052] Taking the encapsulation of OLED devices as an example, the exemplary preparation method of the thin film encapsulation structure of the present invention includes the following steps:

[0053] (1) Place the OLED device on one side of the substrate 10 in a sputtering chamber, and prepare an inorganic layer thin film 30 by sputtering against a target, and the thickness of the film layer is 5-2000 nm;

[0054] (2) preparing an organic layer film 40 on the inorganic layer film 30 of the OLED device, with a film thickness of 50 nm to 15 μm;

[0055] (3) Steps (1) and (2) are repeated to prepare alternately stacked inorganic layer films 30 and organic layer films 40, and the lowermost and uppermost layers are inorganic layer films 30, and the thickness of the formed thin film packaging structure is 100nm~50μm.

[0056] The thin film encapsulation structure formed by the alternate lamination of the above-mentioned inorganic layer films 30 and organic layer films 40 has strong...

Embodiment 1

[0057] Example 1: Alumina-zirconia / acrylic thin film encapsulation structure

[0058] 1) Place the OLED device on one side of the substrate 10 in a sputtering chamber. The first target 60 and the second target 70 are high-purity aluminum targets and zirconium targets respectively, and the reactive gas oxygen is introduced into the sputtering chamber by sputtering the target. Inorganic layer thin film 30 is prepared by irradiation method, and the film thickness is about 500nm;

[0059] (2) Prepare a polyimide film on the inorganic layer film 30 of the OLED device by spin coating, and the film thickness of the organic layer film 40 is about 3 μm;

[0060] (3) Repeat steps (1) and (2) to prepare alternately laminated inorganic layer films 30 and organic layer films 40, the bottom and top layers are inorganic layer films 30, and the number of film layers is 3 layers, forming a film encapsulation structure The thickness is about 4 μm.

Embodiment 2

[0061] Example 2: Alumina-zirconia / acrylic thin film encapsulation structure

[0062] 1) Place the OLED device on one side of the substrate 10 in a sputtering chamber. The first target 60 and the second target 70 are high-purity aluminum targets and zirconium targets respectively, and the reactive gas oxygen is introduced into the sputtering chamber by sputtering the target. The inorganic layer thin film 30 is prepared by irradiation method, and the thickness of the film layer is about 100nm;

[0063] (2) Prepare a polysiloxane-polysilazane film on the inorganic layer film 30 of the OLED device by spraying, and the film thickness of the organic layer film 40 is about 300nm;

[0064] (3) Repeat steps (1) and (2) to prepare alternately stacked inorganic layer films 30 and organic layer films 40, the bottom and top layers are inorganic layer films 30, and the number of film layers is 21 layers, forming a thin film packaging structure The thickness is about 4.1 μm.

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Abstract

The invention provides a film packaging structure which is used for packaging a functional device on a substrate. The film packaging structure is composed of inorganic films and organic films which are laminated alternately, wherein the bottommost layer and the topmost layer are inorganic films, the total number of the inorganic films and the organic films is not less than three, and at least one inorganic film is composed of at least two inorganic materials. The invention further provides a preparation method of the film packaging structure. The invention further provides an organic light emitting apparatus which comprises a substrate, an OLED device disposed on the substrate and the film packaging structure used for packaging the OLED device. The alternately laminated inorganic films and organic films have good water oxygen blocking performance, and can effectively extend the service life of the device. The film packaging structure makes the device flexible, and meets the requirement for a lightweight device. The packaging process is suitable for mass production and is environment-friendly.

Description

technical field [0001] The invention relates to a packaging structure of electronic components, in particular to a thin film packaging structure, a preparation method of the thin film packaging structure and an organic light-emitting device with the structure. Background technique [0002] Organic electroluminescent devices (OLEDs) have the characteristics of low power consumption, light weight, high brightness, wide field of view, fast response, etc., and can realize flexible displays, and have been used in smart terminals such as smartphones and tablet computers. [0003] At present, there are still some problems in the development process of OLED device technology, which restrict the process of OLED device industrialization, and device life is one of the most crucial issues. On the one hand, the lifetime of an OLED device is related to the performance and lifetime of the selected organic material, and on the other hand, it is related to the packaging method of the OLED de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/00
CPCH10K71/00H10K50/8445H01L23/291H01L23/293H10K71/12H10K50/8426H10K2102/00H10K2102/351
Inventor 肖玲
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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