Non-formaldehyde adhesive particle board and preparation method thereof

A particleboard and aldehyde-free glue technology, which is applied in the field of aldehyde-free glue particleboard and its preparation, can solve problems such as poor initial viscosity, and achieve the effect of improving hot pressing efficiency and facilitating industrial production.

Inactive Publication Date: 2017-01-11
宁波中科朝露新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a kind of formaldehyde-free glue partic

Method used

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  • Non-formaldehyde adhesive particle board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The formaldehyde-free soybean gum used in the surface layer of this example is composed as follows in parts by weight:

[0037] Defatted soy flour: 30 parts

[0038] Sodium hydroxide (acid-base regulator): 0.3 parts

[0039]Silane coupling agent KH560 (crosslinking agent): 5 parts

[0040] Casson (antifungal agent): 0.7 parts

[0041] Polyether modified polysiloxane (leveling agent, BYK-320): 0.5 parts

[0042] Water: 48.5 parts

[0043] Rosin emulsion (tackifier, 40% solid content): 25 parts.

[0044] Before sizing, mix sodium hydroxide, silane coupling agent, Cathone, polyether modified polysiloxane, and water evenly, and use it as a liquid component for sizing, defatted soybean flour as a powder component for sizing, and rosin emulsion As another component, the sizing is performed separately, and the formaldehyde-free soybean gum and the surface layer shavings are sized according to the weight ratio of 26:100. In this example, the formaldehyde-free soybean gum i...

Embodiment 2

[0047] The formaldehyde-free soybean gum used in the surface layer of this example is composed as follows in parts by weight:

[0048] Defatted soy flour: 20 parts

[0049] Citric acid (acid-base regulator): 5 parts

[0050] Epoxy resin (crosslinking agent): 10 parts

[0051] Copper sulfate (mold inhibitor): 1 part

[0052] Polyether modified polysiloxane (leveling agent, BYK-320): 1 part

[0053] Water: 50 parts

[0054] Terpene resin emulsion (tackifier, 40% solid content): 33 parts.

[0055] Before sizing, mix citric acid, epoxy resin, copper sulfate, polyether modified polysiloxane, and water evenly, and use it as a liquid component for sizing, defatted soy flour as a powder component for sizing, and terpene resin emulsion As another component, sizing alone, sizing formaldehyde-free soybean gum and surface shavings according to the weight ratio of 20:100, the core layer uses polyphenyl polymethylene polyisocyanate, polyphenyl polymethylene polyisocyanate Isocyanate, ...

Embodiment 3

[0058] The formaldehyde-free soybean gum used in the surface layer of this example is composed as follows in parts by weight:

[0059] Defatted soy flour: 20 parts

[0060] Oxalic acid (acid-base regulator): 5 parts

[0061] Epoxy resin (crosslinking agent): 10 parts

[0062] Copper sulfate (mold inhibitor): 1 part

[0063] Polyether modified polysiloxane (leveling agent, BYK-320): 1 part

[0064] Water: 50 parts

[0065] Rosin emulsion (tackifier, 40% solid content): 13 parts.

[0066] Before sizing, mix oxalic acid, epoxy resin, copper sulfate, polyether modified polysiloxane, and water evenly, and use it as a liquid component for sizing, defatted soybean flour as a powder component for sizing, and rosin emulsion as another The components are sizing separately, the formaldehyde-free soybean gum and the surface shavings are sizing according to the weight ratio of 20:100, the core layer uses toluene diisocyanate, and the toluene diisocyanate, water and core layer shavings...

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Abstract

The invention discloses a non-formaldehyde adhesive particle board and a preparation method thereof. The non-formaldehyde adhesive particle board comprises a surface layer and a core layer; the surface layer adopts non-formaldehyde soy bean glue as adhesive of surface layer shavings; the use level of the non-formaldehyde soy bean glue is 15-50% of the weight of the surface layer shavings; the core layer adopts isocyanate glue as adhesive of core layer shavings; and the use level of isocyanate glue is 2-8% of the weight of the core layer shavings. The non-formaldehyde adhesive particle board solves the problems of hot-pressed board bonding and weak primary bonding performance of isocyanate glue; the preparation method is the same with a preparation process of a traditional formaldehyde-contained particle board; production equipment has no need to transform; all performances reach the standard requirements; and no formaldehyde is used, so that the non-formaldehyde adhesive particle board is a real green environmental protecting product.

Description

technical field [0001] The invention relates to the field of wood-based panel processing, in particular to a formaldehyde-free glue particleboard and a preparation method thereof. Background technique [0002] In order to deal with the problem of free formaldehyde released from wood-based panels, formaldehyde-free isocyanate glue has been used more and more, especially in the field of particle board. At present, there are many particleboard products made of isocyanate glue. For example, Zhang Guohua disclosed in the application number 03143307.3 (zero-formaldehyde particleboard and its production method) the method of using isocyanate glue to prepare formaldehyde-free particleboard. The bonding strength of isocyanate glue is high, but due to its high reactivity, in the process of preparing particleboard , there is a problem of sticking to the hot-pressed board, and a release agent must be used to prevent the isocyanate from sticking to the hot-pressed board, which will great...

Claims

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Application Information

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IPC IPC(8): B27D1/04B27D1/08B27N1/02B27N3/08B32B21/14B32B7/12B32B1/02B32B3/08B32B9/02B32B37/12B32B37/06B32B37/10C09J189/00C09J145/00C09J163/00C09J193/04
CPCB27D1/04B27D1/08B27N1/0263B27N3/08B32B7/12B32B9/02B32B21/14B32B37/06B32B37/10B32B37/12B32B2250/03C08L2205/03C08L2205/035C09J145/00C09J189/00C08L93/04C08L89/00C08L63/00
Inventor 桂成胜刘小青彭顺朱锦徐益忠
Owner 宁波中科朝露新材料有限公司
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