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Ultrasonic-assisted ceramic laser drilling method and device

A laser drilling and ultrasonic-assisted technology, applied in the direction of working accessories, manufacturing tools, stone processing equipment, etc., can solve the problems of thin workpiece thickness and low drilling quality, so as to speed up the cooling speed, improve the quality of the workpiece, and improve the drilling quality. effect of depth

Active Publication Date: 2017-12-01
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present application provides an ultrasonic-assisted ceramic laser drilling method and device, which solves the problems in the prior art that ceramic laser-drillable workpieces are thin in thickness and the drilling quality is not high

Method used

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  • Ultrasonic-assisted ceramic laser drilling method and device
  • Ultrasonic-assisted ceramic laser drilling method and device
  • Ultrasonic-assisted ceramic laser drilling method and device

Examples

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Embodiment 1

[0019] An ultrasonic-assisted laser drilling device for ceramics, such as figure 1 As shown, a frame 1 and an ultrasonic-assisted laser drilling system 10 installed on the frame 1 are included. The ultrasonic-assisted laser drilling system 10 includes a precision platform 11 installed on the frame 1 and an ultrasonic vibration platform 12 installed on the precision platform 11. An ultrasonic generator 13 is arranged inside the ultrasonic vibration platform 12, and a laser drill is arranged above it. The hole system 20 and the upper surface of the ultrasonic vibration platform 12 are used to fix the ceramic workpiece 100 , so that the laser drilling system 20 performs drilling and other processing operations on the ceramic workpiece 100 . When the laser drilling system 20 drills the ceramic workpiece 100 , the ultrasonic generator 13 generates ultrasonic waves propagating along the drilling direction, so that the ceramic workpiece 100 ultrasonically vibrates along the drilling ...

Embodiment 2

[0023] As an improvement of Example 1, such as figure 2 As shown, this embodiment also includes a transport assembly 30 , an inversion assembly 40 and a rotary ultrasonic machining system 50 . The transportation assembly 30 includes an upper suction cup assembly and corresponding guide rails, the guide rails are not shown in the figure, and the upper suction cup assembly moves within the guide rail after absorbing the ceramic workpiece 100 , so as to transport the ceramic workpiece 100 . The turning assembly 40 is used to turn over the ceramic workpiece 100 after primary drilling, so as to perform secondary processing in the rotary ultrasonic machining system 50 .

[0024] like Figure 3-Figure 5 As shown, the turning assembly 40 includes a first suction cup assembly 41 and a second suction cup assembly 42; the first suction cup assembly 41 includes a first base 411 fixed on the frame 1 and a first telescopic rod hinged to the first base 411 412, the upper end of the first ...

Embodiment 3

[0032] An ultrasonic-assisted laser drilling method for ceramics, comprising the following steps:

[0033] S101: Fixing the ceramic workpiece on the ultrasonic vibration platform.

[0034] S102: Use the laser drilling system to drill holes in the ceramic workpiece. At the same time, the ultrasonic generator in the ultrasonic vibration platform generates ultrasonic waves propagating along the drilling direction, so that the ceramic workpiece ultrasonically vibrates along the drilling direction.

[0035] Further, it also includes:

[0036] S103: turning over the ceramic workpiece after drilling once;

[0037] S104: fixing the flipped ceramic workpiece on the rotating ultrasonic platform;

[0038] S105: Use the rotary ultrasonic vibration tool to perform secondary processing on a drilling hole. The rotary ultrasonic vibration tool performs ultrasonic vibration along the drilling axis and rotates with the spindle. into the coolant.

[0039] Further, step S103 turns over the ce...

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Abstract

The invention discloses an ultrasound-assisted ceramic laser drilling method and device, wherein the method comprises the following steps of: fixing a ceramic workpiece on an ultrasonic vibrating platform; drilling the ceramic workpiece by a laser drilling system, and enabling an ultrasonic generator in an ultrasonic vibrating platform to generate ultrasonic waves which propagate in a drilling direction for enabling the ceramic workpiece to ultrasonically vibrate in the drilling direction; putting the ceramic workpiece into an alcohol solution to ultrasonically clean before and after processing; turning over the ceramic workpiece subjected to primary drilling; fixing the turned-over ceramic workpiece onto a rotary ultrasonic platform; carrying out secondary processing on the ceramic piece subjected to primary drilling by a rotary ultrasonic vibrating tool, ultrasonically vibrating the rotary ultrasonic vibrating tool in a drilling axial direction, and rotating the rotary ultrasonic vibrating tool along with a main shaft; and introducing a cooling liquid into holes while carrying out secondary processing on holes of the ceramic workpiece in a rotary ultrasonic manner. According to the ultrasound-assisted ceramic laser drilling method disclosed by the invention, drilling depth of the ceramic workpiece is increased by laser drilling, so that drilling quality of the workpiece is improved; and secondary processing is carried out on the drilled holes in the rotary ultrasonic manner, so that hole wall taper can be further reduced, and hole diameter precision is improved.

Description

technical field [0001] The present application relates to the technical field of laser drilling, in particular to an ultrasonic-assisted ceramic laser drilling method and device. Background technique [0002] Due to their good properties, such as high strength, high hardness, high temperature resistance, and chemical corrosion resistance, ceramic materials have replaced metal materials in many fields and become widely used engineering materials. The hard and brittle nature of ceramics makes them difficult to machine. Traditional processing methods are low in efficiency, high in cost and difficult to control in precision. Laser processing is a high-energy beam processing method, which does not contact the workpiece, and ceramic materials are easy to absorb laser light, which can improve work efficiency. Therefore, laser processing technology shows advantages in the field of ceramic processing. At present, the thickness of the ceramic workpiece for laser drilling is limited...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/14B28D7/02
CPCB28D1/14B28D7/02
Inventor 王成勇王宏建林华泰郑李娟胡小月伍尚华王启民郭伟明
Owner GUANGDONG UNIV OF TECH