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High-temperature-resistant organic silicon-modified epoxy resin and method for preparing same

A technology of epoxy resin and silicone, which is applied in the field of high-temperature-resistant silicone-modified epoxy resin and its preparation, can solve the problems of poor compatibility and long reaction time, and achieve good storage stability, fast response, good storage stability

Inactive Publication Date: 2017-01-25
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN10253255A utilizes linear structure silicone resin to chemically modify epoxy resin, which solves the problem of poor compatibility between the two, but this preparation method, when the temperature is low, the reaction time is long; when the temperature is high, the organic Silicon will undergo self-condensation reaction

Method used

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  • High-temperature-resistant organic silicon-modified epoxy resin and method for preparing same
  • High-temperature-resistant organic silicon-modified epoxy resin and method for preparing same
  • High-temperature-resistant organic silicon-modified epoxy resin and method for preparing same

Examples

Experimental program
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Effect test

Embodiment 1

[0030] Take 10g of silicone intermediate Dow Corning RSN-6018, 15g of epoxy resin E20, and 25g of a mixture of cyclohexanone and butyl acetate, and add them to a clean 500ml four-necked flask in sequence, stir slowly and heat up to 75°C, and wait for After mixing evenly, add 0.05g of zinc naphthenate, then heat up to 125°C, react for 4.5h, and continuously separate the water generated during the reaction, and lower the temperature to obtain a silicone-modified epoxy resin.

[0031] Obtained product technical indicators:

[0032] Initial decomposition temperature: 320°C;

[0033] Hardness: 5H;

[0034] Adhesion: Grade 1.

Embodiment 2

[0036] Take 10g of silicone intermediate Dow Corning RSN-6018, 30g of epoxy resin E20, and 40g of a mixture of cyclohexanone and butyl acetate, and add them to a clean 500ml four-neck flask in turn, stir slowly and heat up to 75°C, and wait for After mixing evenly, add 0.1 g of zinc naphthenate, then heat up to 145° C., react for 5.5 hours, and continuously separate out the water generated during the reaction, and lower the temperature to obtain a silicone-modified epoxy resin.

[0037] Obtained product technical indicators:

[0038] Initial decomposition temperature: 280°C;

[0039] Hardness: 5H;

[0040] Adhesion: Grade 1.

Embodiment 3

[0042] Take 10g of silicone intermediate Dow Corning RSN-6018, 45g of epoxy resin E20, and 55g of a mixture of cyclohexanone and butyl acetate, and add them to a clean 500ml four-necked flask in turn, stir slowly and heat up to 75°C, and wait for After mixing evenly, add 0.13 g of zinc naphthenate, then heat up to 155° C., react for 6 hours, and continuously separate out the water generated during the reaction, and cool down to obtain a silicone-modified epoxy resin.

[0043] Obtained product technical indicators:

[0044] Initial decomposition temperature: 240°C;

[0045] Hardness 4H;

[0046] Adhesion: Level 0.

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Abstract

The invention belongs to the field of polymer functional materials, and discloses a high-temperature-resistant organosilicon-modified epoxy resin and a preparation method thereof. The preparation method is as follows: in parts by weight, 10-25 parts of organosilicon intermediate, 15-60 parts of epoxy resin, and 25-75 parts of solvent are sequentially added to the reactor, stirred and heated to 70-80 °C, and wait for After mixing evenly, add a catalyst, then heat up to 95-185° C. to react for 2-8 hours, and obtain the high-temperature-resistant organosilicon-modified epoxy resin after cooling down. The preparation process of the invention is simple, and the prepared silicone modified epoxy resin has the characteristics of high temperature resistance, ultraviolet aging resistance, high hardness, good storage stability and the like.

Description

technical field [0001] The invention belongs to the field of polymer functional materials, and in particular relates to a high-temperature-resistant organosilicon-modified epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resin refers to a polymer material that contains two or more epoxy groups and can form useful thermosetting polymer materials through the reaction of epoxy groups. It has excellent electrical properties, excellent adhesion, and good mechanical properties. Performance, good corrosion resistance and chemical resistance, it has a wide range of applications in many fields such as electrical and electronic, mechanical processing, civil engineering, aerospace and so on. However, due to the low carbon-carbon bond and carbon-oxygen bond energy of epoxy resin, it is easy to decompose at high temperature, and it is easy to degrade and break the chain after being irradiated by ultraviolet light, which seriously limits the application of...

Claims

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Application Information

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IPC IPC(8): C08G59/14C08G81/00
CPCC08G59/1438C08G81/00
Inventor 夏正斌申政
Owner SOUTH CHINA UNIV OF TECH
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