Multi-mode waveguide 90-degree turning array chip

Abstract

The invention discloses a multi-mode waveguide 90-degree turning array chip comprising a chip body including a substrate, waveguides, and a coating layer. The coating layer enables the waveguides to coat the substrate; the waveguides are parallel to each other and are arranged at equal intervals; and the end surface of one side of each waveguide is a totally reflection surface. The number of the waveguides and the waveguide interval can be adjusted according to specific situations. No lens is introduced; the optical path is short; and light integration can be realized well. Because of direct coupling, the adding and pasting procedures of the lens array are reduced, the coupling precision is high. And the overall stability of the optical path is high. The processing technology of the waveguide array is mature and the cost is low. No expensive lens design and high mode opening cost are needed; and the early-stage research and development investment is reduced. The optical waveguide array is made of a quartz glass material, so that an aging problem at a high temperature is avoided; and reliability on the high or low temperature condition is higher.

Description

[0001] Multimode waveguide 90° steering array chip. technical field [0002] The invention belongs to the field of optical fiber communication, and in particular relates to a multimode waveguide 90° steering array chip. Background technique [0003] In the active optical cable, the integrally formed Lens array including the array lens and the 45° reflective surface is mainly used to realize the 90° conversion of the optical path. However, this Lens array solution has some problems in terms of optical path and structure: First, the optical path is long. The current array lens / 45° reflective surface structure design is to cover the chip (VCSEL and Driver, PIN and TIA) under it. In consideration of the high-speed characteristics, VCSEL and Driver, PIN and TIA must be very close, and a wire bonder is used to connect them with gold wires. Gold wires generally have a wire arc height greater than 100 μm, making the lens There is already a distance of at least 100 μm between the em...

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Problems solved by technology

However, this Lens array solution has some problems in terms of optical path and structure: First, the optical path is long. The current array lens/45° reflective surface structure design is to cover the chip (VCSEL and Driver, PIN and TIA) under it. In consideration of the high-speed characteristics, VCSEL and Driver, PIN and TIA must be very close, and a wire bonder is used to connect them with gold wires. Gold wires generally have a wire arc height greater than 100 μm, making the lens There is already a distance of at least 100 μm between the emitting/receiving surface, plus the optical path of the 45° reflective surface and the optical path generated by the connection mechanism with the optical fiber, the light must pass through a path of 400 μm (entering the optical fiber from the VCSEL or passing through the optical fiber) Fiber to PIN), in this case, a small deviation during or after packa

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