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Multilayer wire structure of printed circuit board, magnetic element and manufacturing method thereof

A technology for printed circuit boards and manufacturing methods, which is applied in the direction of printed circuit manufacturing, printed circuit components, printed circuits, etc., can solve the problems of increasing the size of the overall printed circuit board, achieve the elimination of electroplating process, save process steps, reduce cost effect

Active Publication Date: 2020-07-28
CYNTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The undercutting phenomenon makes it necessary to increase the upper line spacing d2 (same as the line spacing in the photomask for exposure) in order to maintain the same insulation characteristics, resulting in a significant increase in the size of the overall printed circuit board (PCB)

Method used

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  • Multilayer wire structure of printed circuit board, magnetic element and manufacturing method thereof
  • Multilayer wire structure of printed circuit board, magnetic element and manufacturing method thereof
  • Multilayer wire structure of printed circuit board, magnetic element and manufacturing method thereof

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Embodiment Construction

[0064] See Figure 2a-2c , which is a schematic diagram of the process of the PCB multilayer wire structure manufacturing method developed in this case to improve the lack of common means. First, as Figure 2a , which first defines a plurality of wire structures 21 in the form of punching or etching, each wire structure 21 includes a plurality of subunits 211 and connection bars 210 respectively connected to the plurality of subunits 211, and the connection bars 210 can also be With the positioning hole 2100, the shapes of the plurality of sub-units 211 may be the same or slightly different, and each lead structure 21 is integrally formed by stamping or etching. The plurality of wire structures 21 above can be completed with copper conductors or other metal or alloy materials, and can be additionally browned to increase surface roughness.

[0065] see next Figure 2bAn insulating layer 22 is respectively provided between the above-mentioned wire structures 21, and the above-...

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Abstract

The invention discloses a multilayer lead structure of a printed circuit board, a magnetic element, and a manufacturing method of the multilayer lead structure. The method comprises the following steps: providing a first lead structure and a second lead structure; providing an insulation isolation layer between the first lead structure and the second lead structure, wherein the thickness of the insulation isolation layer is smaller than the thickness of the first lead structure or the second lead structure; and performing a pressing process on the first lead structure, the insulation isolation layer and the second lead structure so as to complete the multilayer lead structure of the printed circuit board. The multilayer lead structure and the manufacturing method thereof mainly have the following advantages: a high-pollution electroplating technology can be omitted, process steps are saved, the cost is decreased, and the structure and the method are particularly suitable for a large-current conduction small-dimension printed circuit board.

Description

technical field [0001] The invention relates to a multilayer wire structure, a magnetic element and a manufacturing method thereof, in particular to a multilayer wire structure of a printed circuit board (PCB), a planar circuit element, a magnetic element and a manufacturing method thereof. Background technique [0002] Copper clad laminate (CCL, Copper clad laminate) is the main material of a printed circuit board (hereinafter referred to as PCB for short), and its composition includes glass fiber cloth with increased strength, insulating epoxy resin and copper foil. like Figure 1a As shown, the base material 10 in the middle is made of cured glass fiber cloth and epoxy resin, and the entire surface copper foils 11 and 12 with the same area as the base material 10 are respectively flatly bonded to the upper and lower sides of the base material 10. Surface, mainly in order to increase the strength of the single-piece copper clad substrate (CCL) before forming the multilayer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/09H05K3/00
CPCH05K1/0298H05K1/09H05K2201/09672H05K2203/06
Inventor 林均治陈易威赖奕廷林楚耿李政璋
Owner CYNTEC
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