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Expanded graphite/polyimide composite bipolar plate and preparation method thereof

A technology of expanded graphite and polyimide, which is applied in the field of expanded graphite/polyimide composite bipolar plate and its preparation, can solve the problems of high density, poor corrosion resistance, complicated process, etc., and achieve easy processing and low cost. The effect of cost and charging effect is obvious

Inactive Publication Date: 2017-02-15
CHENGDU YUYA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome defects such as poor corrosion resistance of metal bipolar plates in the prior art, too high density, complex process, etc., to provide low density, easy processing, low cost, corrosion resistance, lightweight and good conductivity expanded graphite ( EG) / polyimide (PI) composite bipolar plate, simple process, environmental protection and energy saving

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Expanded graphite (EG) / polyimide (PI) composite bipolar plate, composed of the following components in weight percentage: expanded graphite (EG) content of 30wt%, thermoplastic polyimide (PI) powder The content is 70wt%, in which EG is the main conductive filler, PI is the binder, and it is prepared by dry mixing process and molding process. Specifically, the method includes the following steps:

[0017] (1) Dry mixing process: Weigh the raw materials according to the above raw material ratio, use an electrostatic generator to apply opposite charges to EG and PI placed in different containers, then add PI to EG, and use a three-dimensional motion mixer to carry out Mix for 10 minutes;

[0018] (2) Pre-compression curing process: preheat the above mixture at 100°C for 0.5h, then pressurize at a constant temperature to 60MPa, mold for 10min and then heat up to 210°C, cool and open the mold after constant temperature curing for 2h to obtain a pre-pressed plate with a thic...

Embodiment 2

[0021] Expanded graphite (EG) / polyimide (PI) composite bipolar plate is composed of the following components in weight percentage: graphene content is 70wt%, polyimide (PI) particle content is 30wt%, Among them, graphene is the main conductive filler, PI is the binder, and it is prepared by dry mixing process and compression molding process. Specifically, the method includes the following steps:

[0022] (1) Dry mixing process: Weigh the raw materials according to the above raw material ratio, use an electrostatic generator to apply opposite charges to graphene and PI placed in different containers, then add PI to the graphene, and use three-dimensional motion to mix machine for mixing for 30 minutes;

[0023] (2) Pre-compression curing process: preheat the above mixture at 120°C for 1 hour, then pressurize at a constant temperature to 80MPa, mold for 30 minutes, then heat up to 230°C, cool and open the mold after constant temperature curing for 4 hours to obtain a pre-presse...

Embodiment 3

[0026] Expanded graphite (EG) / polyimide (PI) composite bipolar plate, composed of the following components in weight percentage: spherical graphite (SG) content is 50wt%, polyimide (PI) content is 50wt %, in which spherical graphite (SG) is the main conductive filler, PI is the binder, and it is prepared by dry mixing process and compression molding process. Specifically, the method includes the following steps:

[0027] (1) Dry mixing process: Weigh the raw materials according to the above raw material ratio, use an electrostatic generator to apply opposite charges to SG and PI placed in different containers, then add PI to SG, and use a three-dimensional motion mixer to carry out Mix for 20 minutes;

[0028] (2) Pre-compression curing process: preheat the above mixture at 110°C for 0.5h, then pressurize at a constant temperature to 80MPa, mold for 10min and then raise the temperature to 210°C, cool and open the mold after constant temperature curing for 3h to obtain a pre-p...

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PUM

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Abstract

The invention discloses an expanded graphite (EG) / polyimide (PI) composite bipolar plate and a preparation method thereof; the expanded graphite / polyimide composite bipolar plate is prepared from, by weight, 30-70% of EG and 30-70% of PI by means of dry mixing process and compression molding process, wherein EG is a main conductive filling material and PI is an adhesive; compared with metal bipolar plates, the bipolar plate has the excellent advantages, such as low density, low cost, corrosion resistance and light weight, the forming process is simple, processing is easy, the process is environment-friendly and energy-efficient, and planar conductivity and bending strength of the bipolar plate may reach 175.25 S per cm<-1> and 68.54 MPa respectively, with significant charge effect.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a bipolar plate of expanded graphite / polyimide composite material and a preparation method thereof. Background technique [0002] Polyimide (PI) adhesive, as a new type of high temperature resistant adhesive, is widely used in aircraft manufacturing, aviation and military fields. With the vigorous development of aerospace and military technology, the requirements for the adhesive performance, antistatic, and high temperature resistance of PI adhesives are gradually increasing, but the existing PI adhesives have been difficult to meet the needs of the development of the aerospace industry. Therefore, it is of great significance and research value to modify PI adhesives and develop PI composite adhesives with high performance and multifunctionality. [0003] Graphene (Graphene, G) has excellent physical and chemical properties, and is a good reinforcement material for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01M8/0213H01M8/0221H01M8/0223
CPCH01M8/0213H01M8/0221H01M8/0223Y02E60/50Y02P70/50
Inventor 向红先
Owner CHENGDU YUYA TECH
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