Full-automatic sapphire grinding machine

Abstract

The invention belongs to the field of sapphire single crystal grinding, and particularly relates to a full-automatic sapphire grinding machine. The full-automatic sapphire grinding machine comprises a rack, an X-direction beam and a control system, wherein the rack is provided with an operation table, and the X-direction beam is in sliding connection with the rack in the Y direction. The operation table comprises a raw material area, a positioning grinding area, a cleaning area, a waste liquid area, a detection area, a waste area and a finished product area, wherein the waste liquid area is arranged under the positioning grinding area and the cleaning area. The control system is electrically connected to a drive mechanism and a transmission mechanism. To achieve the automatic function, the rack and the X-direction beam are both provided with sliding rails, synchronous belts, drive motors and other devices, the X-direction beam can move front and back on the rack along the Y axis, and a Z-direction liquid filling gun and a Z-direction mechanical arm can move front and back on the X-direction beam along the X axis. Compared with the prior art, grinding, cleaning, detecting and other procedures related to the grinding technology are thoroughly fused, and automatic and continuous production becomes possible through usage of the mechanical arm.

Description

technical field [0001] The invention belongs to the field of grinding of sapphire single crystals, in particular to a full-automatic sapphire grinding machine. Background technique [0002] The main application of sapphire: aerospace large-size optical-grade crystal flat sapphire photoelectric window with a diameter greater than 162mm; sapphire substrate for 80% LEDs; large-scale high-quality sapphire military windows and devices, high-speed rectification with a Mach number greater than 2 for sapphire windows The material of choice for masks, photoelectric windows, sapphire windows and optical lenses. [0003] The grinding purpose of the sapphire substrate processing process is to remove the wafer cutting damage layer caused by slicing and improve the flatness of the wafer. Wafer grinding is a gradual process from coarse to fine. The relative mechanical movement of the wafer and the abrasive under a certain pressure reaches the predetermined level. thickness and a good surf...

AI Technical Summary

Problems solved by technology

[0005] With the development of the industry, the application of automation is also increasing in the processing and production of sapphire. People are trying to introduce automation into the grinding process. CN104924197A is an automatic double-disc grinding machine; CN05415166A is a kind of sapphire grinding machine. However, there is no attempt to integrate the grinding, cleaning, and inspection in the sapphire grinding process

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