Semi-automatic mold polishing device capable of preventing flying chips

A polishing device and semi-automatic technology, applied in grinding/polishing safety devices, grinding drive devices, grinding/polishing equipment, etc., can solve the problems of debris splashing, inability to clean debris, etc., to improve utilization, improve Operational efficiency and the effect of improving environmental efficiency

Inactive Publication Date: 2021-07-23
刘妍开
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the deficiencies in the prior art, the purpose of the present invention is to provide a semi-automatic mold polishing device that can prevent flying debris, which solves the problems that the debris cannot be cleaned and the debris splashes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semi-automatic mold polishing device capable of preventing flying chips
  • Semi-automatic mold polishing device capable of preventing flying chips
  • Semi-automatic mold polishing device capable of preventing flying chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] see Figure 1-7 , the present invention provides a technical solution: a semi-automatic mold polishing device capable of preventing flying debris, comprising a box body 1, a bottom box door 6 is movably installed on the bottom of the front side of the box body 1, and a top box door 6 is movably installed on the front side of the box body 1. Box door 8, the internal activity of top box door 8 is equipped with observation window 9, and the outside of top box door 8 is equipped with operation button 7, and the inside of box body 1 is fixedly installed with support plate 16, and the top of support plate 16 is hinged with four A pillar 15, the tops of the four pillars 15 are hinged with a swash plate 23, the inside of the swash plate 23 is provided with a cross chute 24, and the inside of the cross chute 24 is movably equipped with four slide blocks 32, and the tops of the four slide blocks 32 Both are fixedly installed with a soft ring plate 30, the opposite side of the sof...

Embodiment 2

[0044] Such as Figure 1-7 As shown, on the basis of Embodiment 1, the present invention provides a technical solution: the cross chute 24 extends to the outside of the swash plate 23, the adjusting bolt 29 hinges through the limit frame 14 and extends to the outside of the limit frame 14, Both output ends of the double-head motor 25 are hingedly mounted inside the limiting plate 13 , and the polishing roller sleeve 26 is sleeved on the outside of the double-head motor 25 .

[0045] In this embodiment, open the top box door 8, put the mold that needs to be polished into the opposite side of the soft ring plate 30, and rotate the adjusting bolt 29 under the condition of the hinge limit force of the limit frame 14 on the shaft. The seat 31 is rotated inside, and the soft ring plate 30 is pushed inwardly under the action of the bottom slider 32 sliding in the cross chute 24 to clamp the mold, and the double-head motor 25 rotates to drive the outer polishing roller sleeve 26 to ro...

Embodiment 3

[0047] Such as Figure 1-7 As shown, on the basis of Embodiment 1 and Embodiment 2, the present invention provides a technical solution: the top of the support plate 16 is provided with a diversion groove 22, and the diversion pipe 11 is connected to the output end of the diversion groove 22, Quartz sand filter plates 33 are installed in the internal activities of the two groups of blocks 36, semi-permeable membrane filter plates 35 are installed in the internal activities of the two groups of blocks 36, the water storage tank 20 is fixedly installed at the bottom of the inner cavity of the box body 1, the drain 4 and the water inlet pipe 2 run through the outer side of the box body 1, and a water valve 3 is movably installed, and the end of the communication pipe 37 away from the water pump 21 is connected to the atomizer 28, and the communication pipe 37 runs through the support plate 16 and extends to the input end of the atomizer 28 , the atomizer 28 is fixedly installed o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a semi-automatic mold polishing device capable of preventing flying chips. The semi-automatic mold polishing device comprises a box body, a bottom box door is movably installed at the bottom of the front face of the box body, a top box door is movably installed at the top of the front face of the box body, an observation window is movably installed in the top box door, and operation buttons are movably installed on the outer side of the top box door; and a supporting plate is fixedly installed in the box body, four supporting columns are hinged to the top of the supporting plate, an inclined plate is hinged to the tops of the four supporting columns, a cross-shaped sliding groove is formed in the inclined plate, four sliding blocks are movably installed in the cross-shaped sliding groove, and soft annular plates are fixedly installed at the tops of the four sliding blocks. Through an atomizer, when the atomizer atomizes water flow and sprays the water flow to the outer side of a mold, through cooperation with a double-head motor and a polishing roller sleeve, the mold is polished and cooled, and chipping splashing is reduced; and the chipping protection capacity is further improved under the combined action of the box body, through flow guiding of water flow, clearing, collecting and cleaning operations of the internal mold and operation chippings are convenient, and use convenience is improved.

Description

technical field [0001] The invention belongs to the technical field of mold processing, and in particular relates to a semi-automatic mold polishing device capable of preventing flying chips. Background technique [0002] Molds, various molds and tools used in industrial production for injection molding, blow molding, extrusion, die-casting or forging forming, smelting, stamping, etc. to obtain the required products, in short, molds are tools used to make shaped objects , this kind of tool is composed of various parts, and different molds are composed of different parts. It mainly realizes the processing of the shape of the object through the change of the physical state of the formed material. It is known as the mother of industry. Do not polish the mold at the beginning Use the finest oil stone, sandpaper, and abrasive polishing paste, so that the rough lines cannot be thrown away. The live surface polished like that looks very bright, but when it is illuminated from the s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/20B24B29/02B24B41/02B24B41/06B24B47/12B24B47/22B24B55/02B24B55/12
CPCB24B19/20B24B29/02B24B47/22B24B47/12B24B41/06B24B41/02B24B55/12B24B55/02
Inventor 刘妍开
Owner 刘妍开
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap