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Machining method for reducing thickness of outer copper foil of copper-clad plate

A technology of outer layer copper foil and processing method, which is applied to the removal of conductive materials by chemical/electrolytic methods, electrical components, printed circuit manufacturing, etc., which can solve the problem of poor uniformity of surface copper, unclean etching of fine and dense circuit parts, and shipment volume. Low-level problems, to achieve the effect of reducing procurement costs, controllable thinning process, and simple thinning process

Inactive Publication Date: 2017-03-15
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are two main ways for 9μm copper clad laminates to come in: one is directly provided by sheet manufacturers. Several times of copper clad laminate; the second is to thin the copper thickness by acid etching after laminating the copper foil on the outer layer. The acid etching thinning speed is fast and the efficiency is high. The uniformity of the thinned surface copper is poor, and the acid etching thinning error of the 18μm copper-thick copper clad layer can reach 2-2.5μm, which can easily cause the etching of fine and dense lines. This method is mostly used for the production of printed circuit products with low requirements or civilian use

Method used

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  • Machining method for reducing thickness of outer copper foil of copper-clad plate

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Experimental program
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Effect test

Embodiment 1

[0024] The thinning treatment temperature is 38°C; in the sulfuric acid-sodium persulfate microetching solution, the sulfuric acid concentration is 2%, and the sodium persulfate concentration is 40g / L; the thinning treatment time is 85s / μm; the upper spray pressure is 2.0kg / cm 2 , the lower spray pressure is 1.5kg / cm 2 .

[0025] Such as figure 1 as shown, figure 1 Electron microscope scanning of the surface structure of the copper clad layer shows a microscopic rough structure. The key quality control point for the thinning of the outer copper foil of the copper clad laminate depends on the quality control before and after thinning. The 18μm copper clad layer is thinned to 9μm, and the thinning amount is controlled at 1.61±0.1g / dm 2 ;The 12μm copper clad layer is thinned to 9μm, and the thinning amount is controlled to 0.54±0.1g / dm 2 . The surface copper thickness tester is randomly selected to measure the copper thickness of 5 points on the surface of the copper clad ...

Embodiment 2

[0027] The thinning treatment temperature is 35°C; in the sulfuric acid-sodium persulfate microetching solution, the sulfuric acid concentration is 3%, and the sodium persulfate concentration is 32g / L; the thinning treatment time is 86s / μm; the upper spray pressure is 2.2kg / cm 2 , the lower spray pressure is 1.0kg / cm 2 .

Embodiment 3

[0029] The thinning treatment temperature is 36°C; in the sulfuric acid-sodium persulfate microetching solution, the sulfuric acid concentration is 4%, and the sodium persulfate concentration is 34g / L; the thinning treatment time is 87s / μm; the upper spray pressure is 2.4kg / cm 2 , the lower spray pressure is 1.3kg / cm 2 .

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Abstract

The invention discloses a machining method for reducing the thickness of outer copper foil of a copper-clad plate, and the method employs a sulfuric acid-sodium persulfate system to reduce the thickness of the outer copper foil of the copper-clad plate, and is used for reducing the thickness of a copper-clad plate with an 18-micron or 12-micron copper clad layer or a copper-clad plate with the laminated copper foil to 9 microns uniformly, wherein the thickness reduction can be controlled through the weight difference before and after thickness reduction. The method effectively solves a problem of raw materials of the outer layer of a fine circuit printed board during machining. The thinned copper-clad layer is verified to be good in uniformity, to have no residue and oxidation layer, to be good in microscopic rough structure, and to meet the requirements in QJ831B-2011 'General Specification for Space multilayer Printed Circuit Boards' for the minimum copper-clad layer of an extern layer.

Description

[0001] 【Technical field】 [0002] The invention belongs to the technical field of printed circuits and semiconductor electronics, and relates to a processing method for thinning the outer layer copper foil of a copper clad laminate. [0003] 【Background technique】 [0004] With the development of high-density assembly and miniaturization of the whole machine, the line width and spacing of printed circuit board products are becoming increasingly finer (line width spacing within 4 / 4mil). In order to realize the processing of fine circuit products, according to QJ831B-2011 "General Specifications for Multilayer Printed Circuit Boards for Aerospace" 3.4.3.1.3 The minimum thickness of the outer layer conductor is specified in the thickness of the outer layer copper foil, the fine circuit printed board can be Product processing is achieved by using a copper clad layer with an outer layer of 9μm copper thickness. At present, there are two main ways for 9μm copper clad laminates to co...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/0736H05K2203/0789
Inventor 雷雨辰李哲高原
Owner XIAN MICROELECTRONICS TECH INST