Extremely-thin flexible heat-radiation film and method for manufacturing the same

A heat dissipation film and flexible technology, applied in the field of flexible heat dissipation film and its production, can solve the problems of increased thermal resistance, difficulty in punching graphite pressed materials, unfavorable use, etc., achieve high thermal conductivity and heat dissipation performance, excellent heat dissipation performance, and easy processing and use Effect
CN106531902AActive Publication Date: 2017-03-22广州宏庆电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
广州宏庆电子有限公司
Publication Date
2017-03-22

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Abstract

The invention, which relates to the electronic material field, discloses a flexible heat-radiation film and a method for manufacturing the same. The heat-radiation film comprises a carrier film, a protection film layer, and at least one heat radiation layer group arranged between the carrier film and the protection film layer. The heat radiation layer group includes a heat-radiation adhesive film layer for horizontal heat transferring and a heat-radiation metal film layer at least being superposed on one surface of the heat-radiation adhesive film layer ad being used for longitudinal heat transferring, so that the heat radiation layer group having bidirectional heat transferring is formed. The heat-radiation adhesive film layer is made from raw materials including magnetic high-thermal-conductivity powder and resin. For the heat-radiation metal film layer, a material source is processed by a physical means to form atoms or molecules and then the atoms or molecules are deposited on the surface of the heat-radiation adhesive film layer. According to the heat-radiation film, the operation becomes simple; and the formed film layers are light, thin and compact. The flexible heat-radiation film can be applied to various electronic products and communication equipment.
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Description

technical field

[0001] The invention belongs to the field of electronic materials, in particular to a flexible heat dissipation film and a manufacturing method thereof. Background technique

[0002] With the rapid development of the electronics industry, the development of small, light, and thin mobile phones, and the replacement of display panels, especially the rise of OLEDs, all internal materials are required to be flexible, resistant to bending, and thin, light, and easy to use. Processing, low cost, especially the higher and higher requirements for heat dissipation.

[0003] At present, graphite materials (including artificial graphite, natural graphite and graphene) are mainly used, which are bonded by adhesives. Graphite material has excellent thermal conductivity, but it is difficult to process and use directly. Generally, it needs to be bonded with adhesives. Adding an adhesive layer with low thermal conductivity (generally thermal conductivity lower than 1W / K / m) ...

Claims

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