Multi-stage semiconductor thermoelectric power generation and cooling integrated system for hypersonic flight vehicle

Abstract

The invention discloses a multi-stage semiconductor thermoelectric power generation and cooling integrated system for a hypersonic flight vehicle, relates to a multi-stage semiconductor thermoelectric power generation and cooling integrated technology for the hypersonic flight vehicle, and aims to satisfy thermal protection and power supply requirement of long-endurance hypersonic flight. Each stage of semiconductor thermoelectric power generation apparatus comprises multiple N type semiconductor thermoelectric materials, multiple P type semiconductor thermoelectric materials and multiple flow-guiding sheets; the N type semiconductor thermoelectric materials and the P type semiconductor thermoelectric materials are arranged at intervals, and are connected in series in sequence through the flow-guiding sheets; the multiple stages of semiconductor thermoelectric power generation apparatuses are connected in parallel to form a multi-stage semiconductor thermoelectric power generation system; heat-conducting insulating layers, tightly attached to the flow-guiding sheets, are arranged on the two sides of each stage of semiconductor thermoelectric power generation apparatus; and a low-temperature channel and a high-temperature channel which are connected are formed in the two sides of the multi-stage semiconductor thermoelectric power generation system respectively. The multi-stage semiconductor thermoelectric power generation and cooling integrated system is applicable to the hypersonic flight vehicle.

Description

technical field [0001] The invention relates to a multi-stage semiconductor thermoelectric power generation and cooling integration technology for a hypersonic aircraft. Background technique [0002] The long-term flight of a hypersonic vehicle at a high flight Mach number will greatly increase the heat flux density between the leading edge of the body and the combustion chamber, making thermal protection one of the key technologies for hypersonic flight. At the same time, for long-duration hypersonic aircraft, a single battery can no longer meet the power supply demand, and a power supply system that can continuously generate electricity must be introduced. [0003] The extremely high incoming total temperature and possible supersonic combustion result in very high thermal loads on the leading edge of the hypersonic vehicle and on the engine combustion chambers. For the active cooling thermal protection scheme necessary for long voyages, the limited allowable temperature o...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a hypersonic aircraft power generation / cooling system in order to meet the thermal protection and power supply requirements of long-endurance hypersonic flight, which uses the semiconductor temperature difference thermoelectric direct conversion module arranged in multiple stages to meet the power supply requirements of the aircraft, and at the same time Solve the problem of insufficient heat sink of current hypersonic flight fuel

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