Flip chip light-emitting diode packaging structure

Abstract

The invention provides a flip chip light-emitting diode packaging structure, which comprises an LED grain and an LED substrate, wherein the surface of the LED grain is provided with two separate finger aluminum or copper electrode layers, a reflecting layer and two nickel-gold or copper-gold bumps; the reflecting layer is formed through PVD or CVD to cover the electrode layers; the two nickel-gold or copper-gold bumps are formed at predetermined positions of the two electrode layers respectively and are exposed outside the reflecting layer as bonding pads; at least two separate surface adhesion contacts are arranged on the surface of the LED substrate for correspondingly connecting the two nickel-gold or copper-gold bumps of the LED grain on the two separate contacts by virtue of a surface adhesion technology, thereby forming the flip chip LED packaging structure capable of reducing the dosage of noble metals to reduce the manufacturing cost. A packaging adhesive layer which has a uniform thickness and a fluorescent material is formed in a peripheral area of the LED grain in a spraying or molding manner, so that the LED grain forms white light or other colors of light through the light mixing effect of the packaging adhesive layer to reduce the cost of the fluorescent material.

Description

technical field [0001] The present invention relates to a flip-chip light-emitting diode (LED) packaging structure, in particular to a package structure comprising two separate aluminum or copper electrode layers on the surface of the LED grain, a reflective layer formed and covered on the electrode layer and Dinickel-gold or copper-gold bumps are respectively formed on a predetermined position of the two electrode layers and exposed outside the light-reflecting layer for use as soldering pads (bond pad); the dinickel-gold or copper-gold bumps of the LED grain Then by means of surface mount technology (SMT), it is correspondingly connected to two separate contacts on the surface of an LED carrier board to form a flip-chip LED packaging structure that reduces the amount of precious metal used to reduce manufacturing costs. Background technique [0002] In the technical field of flip-chip light-emitting diodes (flip-chip LEDs) such as gallium nitride LED structures or light-em...

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Problems solved by technology

[0005] However, in practical application, the outer protective sheet has the problem that the volume is relatively large so that the cost of fluorescent materials is relatively high, and the outer protective sheet also has uneven thickness so that the emitted light after mixing light, such as white light or other colored light, is relatively uneven The problem is that it affects the manufacturing cost and use efficiency of the LED packaging structure, which is not conducive to the mass production of LED packaging

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