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Prepreg for circuit substrate, laminate, production method and printed circuit board comprising same

A pre-impregnation and pre-impregnation technology, applied in the direction of circuit substrate materials, lamination, printed circuits, etc., can solve problems such as difficulties, achieve the effect of eliminating floating and solving PCB design difficulties

Active Publication Date: 2019-06-14
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This problem of Df changing with resin content has brought great difficulties and challenges to PCB design, especially for high-speed materials

Method used

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  • Prepreg for circuit substrate, laminate, production method and printed circuit board comprising same
  • Prepreg for circuit substrate, laminate, production method and printed circuit board comprising same
  • Prepreg for circuit substrate, laminate, production method and printed circuit board comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0123] (1) Take a suitable container, add a total of 100 parts by mass of polyphenylene ether resin whose two terminal modification groups are acryloyl groups and dicumyl peroxide, and an appropriate amount of solvent, and stir for a certain period of time to form the first glue (polyphenylene ether resin). Ether resin system); then NE type 1080 glass fiber cloth is dipped in the glue solution, and then the solvent is dried to obtain a prepreg core material, and its Dk value after heat treatment is measured to be 3.50;

[0124] (2) Take a suitable container, add 100 parts by mass of polyphenylene ether resin whose two terminal modification groups are acryloyl groups and dicumyl peroxide, an appropriate amount of solvent, stir for a certain period of time, and then add 10 to 30 parts by mass fused silica, fully stirred, and emulsified and dispersed to obtain the second glue (polyphenylene ether resin system) for forming the outer resin layer, and the Dk value after the heat trea...

Embodiment 2

[0132] (1) Take a suitable container, add a total of 100 parts by mass of low-bromine bisphenol A epoxy resin and Dicy (dicyandiamide) with an appropriate equivalent ratio, an appropriate amount of solvent, and an appropriate amount of accelerator, and stir for a certain period of time. A glue solution (epoxy resin system); the E-type 1080 glass fiber cloth is dipped in the glue solution, and then the solvent is dried to obtain a prepreg core material, and the Dk value after the heat treatment is measured to be 4.20;

[0133] (2) Take a suitable container, add a total of 100 parts by mass of low-bromine bisphenol A epoxy resin and Dicy with a suitable equivalent ratio, an appropriate amount of solvent, stir for a certain period of time, and then add 10 to 30 parts by mass of glass powder, an appropriate amount Appropriate type accelerator, carry out sufficient stirring, and carry out emulsification dispersion promptly obtain the second glue solution (epoxy resin system) that fo...

Embodiment 3

[0142] (1) Take a suitable container, add bisphenol A type cyanate resin and dicyclopentadiene type novolak epoxy resin in total 100 parts by mass, appropriate amount of solvent, appropriate type of accelerator, and stir for a certain period of time to form the first glue Liquid (cyanate ester resin system); then NE type 2116 glass fiber cloth is dipped in the glue solution, and then the solvent is dried to obtain a prepreg core material, and its Dk value after heat treatment is measured to be 3.70;

[0143] (2) Take a suitable container, add a total of 100 parts by mass of polyphenylene ether resin with acryloyl modified groups at both ends and dicumyl peroxide, an appropriate amount of solvent, stir for a certain period of time, and then add 10 to 30 parts by mass fused silica, fully stirred, and emulsified and dispersed to obtain the second glue (polyphenylene ether resin system) for forming the outer resin layer, and the Dk value after the heat treatment was measured to be ...

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Abstract

The invention relates to a preimpregnated material used for a circuit substrate. The preimpregnated material comprises a preimpregnated core material layer and an outer resin layer formed on at least one side of the preimpregnated core material layer, wherein the preimpregnated core material layer comprises a reinforcing material and an inner resin layer wrapped at the outer side of the reinforcing material; the dielectric constant Dk<core> of the preimpregnated core material layer, the dielectric constant Dk<outer> of the outer resin layer and the absolute difference value Delta Dk of the Dk<core> and the Dk<outer> meet the following conditions: Delta Dk / Dk<core> * 100% is no more than 10%, and preferably Delta Dk / Dk<core> * 100% is no more than 5%; or the dielectric loss Df<core> of the preimpregnated core material layer, the dielectric loss Df<outer> of the outer resin layer and the absolute difference value Delta Dk of the Df<core> and the Df<outer> meet the following conditions: Delta Df / Df<core> * 100% is no more than 10%, and preferably Delta Df / Df<core> * 100% is no more than 5%. According to the invention, the fluctuation range of Dk (or Df) of the laminated board can be controlled to be + / - 5%, so the problem of large fluctuation of Dk (or Df) of a copper clad laminate with the change of the content of resin in a substrate is solved.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a prepreg for a circuit substrate, a laminate, a preparation method and a printed circuit board containing the same. Background technique [0002] At present, the manufacturing process of the laminate is mainly as follows: the reinforcing material impregnated with the resin composition is baked and dried, so that the resin composition becomes a prepreg with a certain degree of curing from the uncured glue, and then the prepreg is Prepreg slices are made into prepreg sheets, and then one or more prepreg sheets are laminated together, and one side / both sides are covered with copper foil or release film, using a high temperature press machine, after heating, adding Pressed to make a laminate, it is mainly used in the production of printed circuit boards (PCB). The manufacturing process of this laminate can realize the manufacturing requirements of copper cl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/12C08L63/00C08L79/04C08K7/14C08K3/36C08K3/40C08J5/24B32B17/04B32B27/04B32B15/20B32B15/14B32B17/06B32B37/02B32B38/08H05K1/03
CPCB32B15/14B32B15/20B32B37/02B32B38/08B32B2260/021B32B2260/046B32B2262/0261B32B2262/101C08J5/24C08J2363/00C08J2371/12C08J2463/00C08J2479/04C08K3/36C08K3/40C08K7/14C08L63/00C08L71/126C08L2205/025C08L2205/03H05K1/036H05K1/0366H05K2201/029C08L79/04
Inventor 陈虎
Owner GUANGDONG SHENGYI SCI TECH