A kind of preparation method of silicon carbide reinforced aluminum matrix composite material

Abstract

The invention discloses a preparation method of an SiC-reinforced aluminum matrix composite. The preparation method comprises the steps of carrying out preliminary alkaline washing to remove Si, SiO2 included slag and an SiO2 film formed on the surface of SiC; carrying out etching on the surface of SiC particles; soaking a precursor solution to obtain SiC particles attached with a precursor phase on the surface; carrying out thermal decomposition to obtain SiC particles attached with an Ir-Cu composite layer on the surface; and carrying out pressureless infiltration to prepare the SiC-reinforced aluminum matrix composite. By using the preparation method of the SiC-reinforced aluminum matrix composite, disclosed by the invention, one Ir-Cu composite layer can be firstly formed on the surface of SiC before pressureless infiltration, the attachment degrees of a reinforced-phase particle interface and an aluminum alloy liquid-phase interface can be effectively improved, and furthermore, holes produced between two phases are reduced, which macroscopically shows that the thermal conductivity of the composite is increased.

Description

technical field [0001] The invention belongs to the field of metal matrix composite materials, in particular to a preparation method of silicon carbide reinforced aluminum matrix composite materials. Background technique [0002] With the rapid development of modern electronic information technology, the internal chip integration of electronic components is rapidly increasing, the power is rapidly increasing, the heat generated by the operation of electronic devices is increasing sharply, and the demand for thermal conductivity of electronic packaging materials is getting higher and higher; at the same time With the improvement of chip integration, the internal structure of electronic products tends to be more complex and refined, which requires higher and higher thermal matching performance of electronic packaging materials and chips and other semiconductor devices. In recent years, the advantages of particle-reinforced metal-matrix composites as electronic packaging materi...

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Problems solved by technology

The wetting and adhesion behavior between the liquid metal and the solid reinforcement phase in the liquid metal method plays a crucial role, and the pores and phase interface states generated between the two phases have a great influence on the mechanical properties, thermophysical properties and Corrosion resistance has a very intuitive impact, but at present, there are few studies on the above-mentioned defects of composite materials manufactured by liquid phase metal method. The phase cannot be fully infiltrated, and material defects such as residual pores and microcracks are easily formed between the two phases, and microcracks are easily formed between the SiC particles and the aluminum matrix, resulting in insufficient performance of the prepared electronic components, which restricts the development of SiCp / Al composite materials.

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