A kind of high adhesion epoxy molding compound for semiconductor packaging
A technology of epoxy molding compound and semiconductor, which is applied in the field of epoxy molding compound, which can solve the problems of low probability of interface improvement chemical reaction, difficulty in meeting high adhesion, complex interface between packaging structure and materials, etc.
Active Publication Date: 2019-06-07
江苏中科科化新材料股份有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, due to the small molecular chain of a single coupling agent and the complexity of the interface between the packaging structure and the material, the probability of chemical reactions on which the improvement of the interface depends is not high, and it is difficult to meet the demand for high adhesion.
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～12
[0055] See Table 1 for the composition of the compositions of Examples 1-12, and see Table 1 for the evaluation results.
[0056] The preparation method of embodiment 1~12 composition is as follows:
[0057] After weighing and mixing the ingredients according to the proportion, melt and knead them evenly on an open rubber mixer preheated at a temperature of 60-110°C, remove the uniformly mixed materials from the open rubber mixer, cool them naturally, and pulverize them to obtain powder Shaped material, preformed into cake material, obtained epoxy molding compound molding material, and evaluated with the following methods, the results are shown in Table 1.
[0058]The evaluation method of embodiment 1~12 composition is as follows:
[0059] Adhesion test
[0060] Sample preparation—Using a low-pressure transfer molding machine to mold the obtained epoxy molding compound molding material on the surface of the sample under the conditions of mold temperature of 175°C, injection ...
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The invention relates to a high-adhesion epoxy molding compound for packaging a semiconductor. The high-adhesion epoxy molding compound is prepared from the following raw materials: 5-18wt% of epoxy resin, 2.5-10wt% of phenolic resin, 0.05-0.5wt% of a curing accelerator, 60-90wt% of fillers, 0.1-0.8wt% of a bonding modifier, 0.1-1.5wt% of a release agent and 0.1-1wt% of a coupling agent; the raw materials are weighed; the components are mixed evenly, melted and mixed on an open rubber mixing mill, and naturally cooled and crushed to obtain the epoxy molding compound which is capable of improving the adhesive strength of a chip and a frame in a semiconductor device.
Description
technical field [0001] The invention relates to an epoxy molding compound for semiconductor packaging, in particular to an epoxy molding compound for semiconductor packaging that improves adhesion with chips and frames. Background technique [0002] Epoxy molding compound has many excellent properties and has been widely used in the field of packaging. It is the mainstream material for semiconductor components and integrated circuit packaging. In recent years, semiconductors have developed towards high integration, with larger chips and more complex structures. In order to ensure the reliability of devices, higher requirements have been put forward for the adhesion between the plastic packaging compound inside the package, the chips, and the surfaces of various frames. [0003] The components of epoxy molding compound for semiconductor packaging generally include epoxy resin, curing agent, curing accelerator, filler, flame retardant, release agent, coupling agent, colorant, ...
Claims
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IPC IPC(8): C08L63/04C08L63/00C08L91/06C08L83/08C08K13/02C08K5/3445C08K3/36C08K5/5435C08K3/38C08K5/18
CPCC08L63/00C08L63/04C08L2201/02C08L2203/206C08L2205/025C08L2205/035C08L91/06C08L83/08C08K13/02C08K5/3445C08K3/36C08K5/5435C08K2003/387C08K5/18
Inventor 王善学李刚卢绪奎李海亮周洪涛徐伟
Owner 江苏中科科化新材料股份有限公司