After-tack prevention high voltage withstanding mica tape

Abstract

The invention relates to a manufacturing method of an after-tack prevention high voltage withstanding mica tape, which solves a technical problem of after-tack in the process of producing, storing and using the mica tape, and increases the dielectric strength and the fire resistance of the mica tape at the same time. The after-tack prevention high voltage withstanding mica tape is prepared by adopting the following method which comprises the steps of 1, preparing an organic silicon rubber solution; 2, preparing an inorganic coating adhesive; 3, adjusting the distance between pressing rollers of a three-roller calendar, and pouring the organic silicon rubber solution; 4, setting the temperature of a vulcanization box; 5, pouring the inorganic coating adhesive into a scraping-coating groove; 6, uniformly coating one side of the mica tape with the organic silicon rubber solution, and performing curing through the vulcanization box; and 7, scraping and coating the inorganic coating adhesive on the side, which is coated with the organic silicon rubber, of the mica tape which is molded through vulcanization, and then performing curing, rolling and winding through the vulcanization box. The mica tape manufactured according to the invention is high voltage withstanding and free of after-tack and displacement and does not fall off.

Description

Technical field [0001] The invention relates to an electrical insulating material, in particular to a method for manufacturing an anti-sticking and high-voltage resistant mica tape. Background technique [0002] Mica tape is a traditional insulation product. Because of its excellent high temperature resistance and voltage resistance, it is often used in fire-resistant wires and cables. However, in the process of manufacturing and storage of mica refractory tape, due to the influence of polar water vapor in the air, the phenomenon of re-sticking often occurs. Once the refractory mica tape is re-adhesive during use, serious quality problems will occur during the winding process of the wire and cable: first, the winding speed slows down, reducing work efficiency; the second is caused by re-adhesive The shedding, displacement and unevenness of the mica paper make the fire resistance of the mica tape unstable and reduce the pressure resistance; thirdly, it greatly affects the fire re...

AI Technical Summary

Problems solved by technology

However, during the manufacture and storage of mica refractory belts, due to the influence of polar water vapor in the air, back-sticking often occurs.

Once the refractory mica tape has back-sticking during use, serious quality problems will occur in the wrapping process of wires and cables: first, the speed of wrapping slows down, reducing work efficiency; second, it is caused by back-sticking The shedding, displacement and unevenness of the mica paper make the fire resistance of the mica tape unstable and reduce the pressure resistance; the third is that it greatly affects the fire resistance pass rate of the mica tape