Copper foil with carrier and method of manufacturing printed wiring board using the copper foil with carrier
A technology of copper foil and carrier, which is applied in the manufacturing field of copper foil with carrier and printed circuit boards using the copper foil with carrier, which can solve problems such as short circuit, circuit disconnection, and yield drop
Active Publication Date: 2021-04-16
MITSUI MINING & SMELTING CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
In the case where a circuit is formed on the copper foil layer to which foreign matter adheres as described above, defects such as disconnection and short circuit may occur in the circuit, resulting in a decrease in yield
Method used
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Embodiment Construction
[0030] Copper foil with carrier
[0031] figure 1 A schematic perspective view of an example of the copper foil with a carrier of the present invention is shown in . figure 1 The copper foil 10 with a carrier shown in has the carrier layer 12, the peeling layer 14, and the ultra-thin copper layer 16 in this order. The copper foil 10 with a carrier also has a protective layer 18 on the ultra-thin copper layer 16 . Owing to having the protective layer 18, it is possible to effectively prevent foreign matter (representatively, resin powder from the coreless support (prepreg, etc.) etc.) of attachment. In particular, the lamination process of the coreless support is carried out in an environment where there are many flying objects from the prepreg and the cleanliness is low, and static electricity is likely to be generated due to the friction of the buffer member. The surrounding environment is equipped with hydraulic cylinders and hydraulic pumps. Therefore, in the lamin...
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Abstract
The present invention provides a copper foil with a carrier, which can prevent foreign matter from adhering to the surface of an ultra-thin copper layer in the manufacture of a printed circuit board (such as a coreless method, etc.), and can prevent the ultra-thin copper layer from being damaged when the protective layer is peeled off. Damage, deformation of the roughened surface, and no residue remains on the surface of the ultra-thin copper layer after peeling off the protective layer. This copper foil with a carrier has this carrier layer, a peeling layer, and an ultra-thin copper layer in this order in order. The copper foil with carrier also has a protective layer on the ultra-thin copper layer. The protective layer is bonded to the ultra-thin copper layer at least one protective layer bonding part, and is not bonded to the ultra-thin copper layer in the area other than the protective layer bonding part. layer bonding.
Description
technical field [0001] The present invention relates to a copper foil with a carrier and a method for manufacturing a printed wiring board using the copper foil with a carrier. Background technique [0002] In recent years, in order to increase the mounting density of printed wiring boards and achieve miniaturization, multilayering of printed wiring boards has been widely carried out. Such multilayer printed wiring boards are used in many portable electronic devices for the purpose of weight reduction and miniaturization. Then, the multilayer printed wiring board is required to further reduce the thickness of the interlayer insulating layer and further reduce the weight of the wiring board. [0003] As a technology satisfying the above-mentioned requirements, a method of manufacturing a printed wiring board in which a wiring layer is formed directly on an ultrathin metal layer and then multilayered has been proposed, and a manufacturing method using a coreless build-up meth...
Claims
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IPC IPC(8): B32B15/00H05K1/09H05K3/46
CPCB32B15/00H05K1/09H05K3/46B32B7/04B32B7/14B32B15/043B32B15/08B32B15/20B32B2311/12B32B2457/08H05K3/4652
Inventor 饭田浩人立冈步
Owner MITSUI MINING & SMELTING CO LTD