Environment-friendly tin paste special for lead-free low-temperature through hole

A low-temperature, environmentally friendly technology, used in welding media, welding/cutting media/materials, metal processing equipment, etc., can solve the problems of high assembly density of electronic components, easy drop of solder paste, high temperature resistance, etc. The effect of stable volume, transparent residue after welding, and strong reliability after welding

Inactive Publication Date: 2017-05-31
东莞市合点电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the electronic manufacturing industry, the production of power chargers is becoming more and more modernized. However, due to the limitation of single-sided and double-sided mixed packaging of the product itself, the assembly of power chargers must be made of surface mount (SMT) and through-hole plug-in. (THT) consists of two different processes. Due to the continuous development of electronic processing in the direction of miniaturization and high integration, the electronic components used in power chargers are also getting smaller and smaller, and the assembly density of electronic components is getting higher and higher, especially in In the THT process, the solder paste is easy to drop when the components are inserted, resulting in a more serious phenomenon of virtual soldering, so the requirements for the solder paste are getting higher and higher, especially for the post-soldering reliability of the solder paste. The device requires that the components are not resistant t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: A kind of lead-free low-temperature through-hole special environment-friendly solder paste is made up of Sn42Bi58 alloy tin powder and soldering paste, and the proportion of Sn42Bi58 alloy tin powder is 89%, and solder paste is made up of the following, 1-6% Thixotropic agent 6650, 35-58% resin KE-604, 2-3% phenolic antioxidant, 1-2% non-ionic halogen compound, 35-55% diethylene glycol hexyl ether, 1.5 -7% mass active agent (such as succinic acid, 24 acid, etc.).

[0022] Solder paste production process:

[0023] Heat and dissolve the rosin and solvent at a temperature of 150 degrees and stir continuously until it dissolves into a transparent and uniform liquid, then stop heating; cool down to 100 degrees, add thixotropic agent and antioxidant, stir quickly and dissolve into a transparent liquid; cool down Add a non-ionic halogen compound at 80 degrees, the active agent is quickly stirred and dissolved into a homogeneous transparent liquid, continue to co...

Embodiment 2

[0026] Embodiment 2: A kind of lead-free low-temperature through-hole special environment-friendly solder paste is made up of Sn42Bi58 alloy tin powder and flux paste, and the proportion of Sn42Bi58 alloy tin powder is 89%, and solder paste is composed of the following, 2-5% Thixotropic agent 6650, 30-60% resin KE-604, 1-2% phenolic antioxidant, 1-4% non-ionic halogen compound, 30-57% diethylene glycol hexyl ether, 1.5 -6% active agent by mass (such as succinic acid, 24 acid, etc.).

[0027] The manufacturing process of solder paste is the same as that in Example 1.

[0028] The manufacturing method of the environmentally friendly solder paste for lead-free low-temperature vias is the same as that in Embodiment 1.

Embodiment 3

[0029] Embodiment 3: A kind of environment-friendly solder paste for lead-free low-temperature through hole, is made up of Sn42Bi58 alloy tin powder and flux paste, and the proportion of Sn42Bi58 alloy tin powder is 89%, and solder paste is composed of the following, 1.5-5.5% Thixotropic agent 6650, 20-60% resin KE-604, 3-5% phenolic antioxidant, 2.3-4.8% non-ionic halogen compound, 30-62% diethylene glycol hexyl ether, 1.8 - 5.6% by mass of active agents (such as succinic acid, 24 acid, etc.).

[0030] The manufacturing process of solder paste is the same as that in Example 1.

[0031] The manufacturing method of the environmentally friendly solder paste for lead-free low-temperature vias is the same as that in Embodiment 1.

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PUM

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Abstract

The invention relates to environment-friendly tin paste special for a lead-free low-temperature through hole. The environment-friendly tin paste is composed of Sn42Bi58 alloy tin powder and flux paste. The flux paste includes, by mass, 1%-6% of a thixotropic agent 6650, 35%-58% of resin KE-604, 2%-3% of a phenolic antioxidant, 1%-2% of a nonionic halogen compound, 35%-55% of ethylene glycol monohexyl ether and 1.5%-7% of an active agent. The weight ratio of the Sn42Bi58 alloy tin powder to the flux paste is 89:11. According to the environment-friendly tin paste, the phenomenon that the tin paste falls off during element inserting in the THT process is effectively solved, and the stability of the paste is kept; few postwelding residues are generated, transparency performance and insulation performance are good, cleaning is avoided, and extremely high postwelding reliability is achieved; and the unit size of the postwelding tin paste is quite stable, and the phenomenon of much tin or little tin cannot happen.

Description

technical field [0001] The invention relates to a welding material for assembling an electronic printed circuit board, in particular to a special environment-friendly solder paste for lead-free low-temperature through-holes. Background technique [0002] With the rapid development of the electronic manufacturing industry, the production of power chargers is becoming more and more modernized. However, due to the limitation of single-sided and double-sided mixed packaging of the product itself, the assembly of power chargers must be made of surface mount (SMT) and through-hole plug-in. (THT) consists of two different processes. Due to the continuous development of electronic processing in the direction of miniaturization and high integration, the electronic components used in power chargers are also getting smaller and smaller, and the assembly density of electronic components is getting higher and higher, especially in In the THT process, the solder paste is easy to drop when...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/262B23K35/3613
Inventor 岳斌石波
Owner 东莞市合点电子材料有限公司
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