Manufacture device and manufacture method for height limit type preformed soldering terminals

Abstract

The invention particularly relates to a manufacture device and a manufacture method for height limit type preformed soldering terminals. The manufacture device comprises a support, a guide mechanism, a slotting mechanism, a metal wire guide mechanism and a wire implanting mechanism, and the guide mechanism, the slotting mechanism, the metal wire guide mechanism and the wire implanting mechanism are arranged on the support in sequence. The manufacture method includes: digging a slot on a weld blank strip through the slotting mechanism, the wire implanting mechanism pressing a metal wire into the slot dug out in the weld blank strip, and punching the weld blank strip into one preformed soldering terminal according to the length requirement of the soldering terminal. The manufacture device is high in continuation degree, strong in controllability and wide in applicability, can manufacture the height limit type preformed soldering terminals instead of manual production, assures dimensional accuracy and stability of products, and is high in production efficiency and low in use and manufacture cost.

Description

technical field [0001] The invention relates to the technical field of welding material manufacturing equipment, in particular to a manufacturing device and method for a height-limited preform. Background technique [0002] Solder preform is a kind of precision-shaped solder that can be made into different shapes, sizes and surface shapes according to requirements. It is suitable for various product manufacturing processes with small tolerances. It is widely used in printed circuit board (PCB) assembly, connectors And terminal equipment, chip connection, power module substrate attachment, filter connector and electronic component assembly and other fields. Solder preforms are usually used in occasions that have special requirements on the shape and quality of the solder, and can be made into any size and shape to meet customer needs. Solder preforms have the advantages of diverse shapes, good solderability, reduced flux spatter, and precise control of metal usage when used ...

AI Technical Summary

Problems solved by technology

For the welding of small contact surfaces of electronic packages (such as mobile phone chips), the solder layer is first required to have a certain height, but when ordinary solder preforms are melted, they are flattened due to the gravity of the upper surface device or liner, making The thickness of the solder layer is too small, which leads to low welding strength and poor electrical and thermal conductivity. To solve this problem, a height-limited solder preform has been invented. However, if the height-limited solder preform is made manually, not only workers Labor intensity is high, production efficiency is low, and the stability of product quality is difficult to guarantee

There is no relevant public report about the preparation device of the height-limited solder preform

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