Novel micro-fluidic chip forming die and method

Abstract

The invention provides a novel micro-fluidic chip forming die and method and belongs to the field of micromachining. The die mainly comprises a forming assembly, a demoulding assembly, a die assembling air cylinder, a fixing bracket, M5*15 hexagonal head bolts, guide pillars, a guide pillar connection plate, M5*30 hexagonal head bolts, a temperature controller, a movable die plate, a table, a die jacking air cylinder, a jacking rod push plate, a core die fixing block, jacking rods, spring sleeves, a copper pressing block, a core die and a direct current power source. The novel micro-fluidic chip forming method includes the steps that die assembling is performed, wherein liquid-state dimethyl siloxane is poured into a die cavity; the direct current power source is utilized to heat the surface of the die cavity; product solidification is performed, wherein after die sinking is performed, the demoulding assembly jacks a product out; and charging bars and flanges are removed, and the product is obtained. The novel micro-fluidic chip forming method has the advantages of being energy saving, safe and high in forming precision.

Description

technical field [0001] The invention belongs to the field of micromachining, and relates to a novel hot embossing molding technology and equipment. The application fields mainly include: micron nanomachining, microelectronics, material science, optics, microelectromechanical systems, surface chemistry and other fields. Background technique [0002] In recent years, due to the application of microstructure products in more industries, the demand has increased sharply, and the precision requirements have become higher and higher. At present, most of the existing microstructure products are formed by thermal embossing of finished polymers. And the thermoplastic polymer is used, the basic principle is: firstly, the polymer substrate is heated above its glass transition temperature, and then under a certain pressure, the imprinting mold is pressed on the polymer substrate, so that the polymer is filled into the mold In the microstructure on the surface, demould after cooling and ...

AI Technical Summary

Problems solved by technology

However, the use of thermoplastic polymers for thermal embossing has the following problems: embossing needs to be realized under high temperature and high pressure conditions, and even under high temperature and high pressure conditions, the polymer may not completely fill the cavity; the embossing material is not enough Material heating and cooling time is too long when the thermal conductivity is high

Due to these problems, the wide application of polymer hot embossing technology has been limited

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