Modified phenolic resin adhesive
A technology of phenolic resin glue and adhesive, which is applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problem of low bonding strength of adhesives, and improve the adhesive strength Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0028] 1) Prepare raw materials:
[0029] name Dosage phenol 30 mole parts formaldehyde 60 mole parts sodium hydroxide 6 mole parts Melamine 15 parts by mole Triglycerides of oleic acid 10 mole parts
[0030] 2) Preparation of modified adhesive
[0031] Add the above 4 kinds of raw materials into the reaction kettle, and control the temperature at 50°C. After reacting for 5 hours, the modified adhesive was obtained.
Embodiment 2
[0033] 1) Prepare raw materials:
[0034]
[0035] 2) Preparation of modified adhesive
[0036] Add the above 4 kinds of raw materials into the reaction kettle, and control the temperature at 50°C. After reacting for 5 hours, the modified adhesive was obtained.
Embodiment 3
[0038] 1) Prepare raw materials:
[0039] name Dosage phenol 30 mole parts formaldehyde 60 mole parts sodium hydroxide 6 mole parts Melamine 15 parts by mole Tannins 10 mole parts
[0040] 2) Preparation of modified adhesive
[0041] Add the above 4 kinds of raw materials into the reaction kettle, and control the temperature at 50°C. After reacting for 5 hours, the modified adhesive was obtained.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com