Anti-aging epoxy resin and fiberglass fabric-compounded printed circuit board material and preparation method thereof

Abstract

The invention discloses an anti-aging epoxy resin and fiberglass fabric-compounded printed circuit board material which is prepared from the following raw materials in parts by weight: 32-34 parts of 1080 fiberglass fabric, 40-42 parts of E-51 epoxy resin, 29-30 parts of phenolic resin, 0.3-0.4 part of 4-ethyl imidazole, 20-22 parts of carbon nanotubes, 2.3-2.6 parts of a vinylidene fluoride-hexafluoropropylene copolymer, 25-30 parts of butadiene, an appropriate amount of hydrogenated gasoline, 0.01-0.02 part of nickel naphthenate, 0.4-0.5 part of triisobutyl aluminum, 0.7-0.8 part of boron trifluoride ether, 2.3-6 parts of micron-sized zinc oxide, 1-1.3 part of lithium iron phosphate and 1.3-1.5 part of zinc diamyl dithiocarbamate. The anti-aging epoxy resin and fiberglass fabric-compounded printed circuit board material provided by the invention has improved light ageing resistance and thermal ageing resistance by using the micron-sized zinc oxide, lithium iron phosphate and zinc diamyl dithiocarbamate, and is good in bacteria resistance and wear resistance.

Description

technical field [0001] The invention relates to the technical field of printed circuit board prepregs, in particular to an anti-aging epoxy resin glass fiber cloth composite printed circuit board material and a preparation method thereof. Background technique [0002] Printed circuit boards are the main components in electronic products, and their quality and reliability are crucial to electronic products. Epoxy prepreg (Epoxy Prepreg) is currently the main raw material for the production of printed circuit boards. Storage aging will have a significant impact on the performance of epoxy prepreg, and then affect the quality of printed circuit boards. The moisture and heat aging resistance of printed circuit boards directly affects the reliability of electronic products, and it is of great significance to characterize and improve the moisture and heat aging resistance of printed circuit boards for the electronics industry. In this paper, by combining a variety of research me...

AI Technical Summary

Problems solved by technology

[0003] The water resistance of the printed circuit board obtained in the article "Storage Aging of Epoxy Prepreg and Humidity and Heat Aging of Printed Circuit Board" has been improved, but the epoxy resin is brittle and has poor adhesion to the glass surface. Vibration will peel off and affect the stability of the circuit board. It needs to be improved, and the aging resistance of the circuit board needs to be improved