Nanometer sepiolite powder modified epoxy resin and fiberglass fabric composite printed circuit board material and preparation method thereof

Abstract

The invention discloses a nanometer sepiolite powder modified epoxy resin and fiberglass fabric composite printed circuit board material, which is prepared from the following raw materials in parts by weight: 32 to 34 parts of a 1080 fiberglass fabric, 40 to 42 parts of E-51 epoxy resin, 29 to 30 of phenolic resin, 0.3 to 0.4 part of 4-ethylimidazole, 20 to 22 parts of carbon nanotubes, 2.3 to 2.6 parts of a vinylidene fluoride-hexafluoro propylene copolymer, 25 to 30 parts of butadiene, a proper amount of hydrogenated gasoline, 0.01 to 0.02 part of nickel naphthenate, 0.4 to 0.5 part of triisobutylaluminium, 0.7 to 0.8 part of boron trifluoride diethyl ether, 1.2 to 1.4 parts of methyl tin mercaptide, 2 to 2.4 parts of nanometer sepiolite powder and 0.8 to 1 part of ethoxylated lanolin. According to the nanometer sepiolite powder modified epoxy resin and fiberglass fabric composite printed circuit board material, the nanometer sepiolite powder is used, so that the heat resistance and adhesive strength of the epoxy resin can be improved; the methyl tin mercaptide is adsorbed into pores of the nanometer sepiolite powder, so that the heat stability of the material is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board prepregs, in particular to a nano sepiolite powder modified epoxy resin glass fiber cloth composite printed circuit board material and a preparation method thereof. Background technique [0002] Printed circuit boards are the main components in electronic products, and their quality and reliability are crucial to electronic products. Epoxy prepreg (Epoxy Prepreg) is currently the main raw material for the production of printed circuit boards. Storage aging will have a significant impact on the performance of epoxy prepreg, and then affect the quality of printed circuit boards. The moisture and heat aging resistance of printed circuit boards directly affects the reliability of electronic products, and it is of great significance to characterize and improve the moisture and heat aging resistance of printed circuit boards for the electronics industry. In this paper, by combining a var...

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Problems solved by technology

[0003] The water resistance of the printed circuit board obtained in the article "Storage Aging of Epoxy Prepreg and Humidity and Heat Aging of Printed Circuit Board" has been improved, but the epoxy resin is brittle and has poor adhesion to the glass surface. Vibration will peel off, which will affect the stability of the circuit board. It needs to be improved, and the bonding strength of the circuit board needs to be improved