Epoxy resin and fiberglass fabric-compounded printed circuit board material with good dielectric properties and preparation method of epoxy resin and fiberglass fabric-compounded printed circuit board material

Abstract

The invention discloses an epoxy resin and fiberglass fabric-compounded printed circuit board material with good dielectric properties. The epoxy resin and fiberglass fabric-compounded printed circuit board material is prepared from the following raw materials in parts by weight: 32-34 parts of 1080 fiberglass cloth, 40-42 parts of E-51 epoxy resin, 29-30 parts of phenolic resin, 0.3-0.4 part of 4-ethyl imidazole, 20-22 parts of carbon nanotubes, 2.3-2.6 parts of vinylidene fluoride-hexafluoropropylene copolymers, 25-30 parts of butadiene, an appropriate amount of hydrogenated gasoline, 0.01-0.02 part of nickel naphthenate, 0.4-0.5 part of triisobutyl aluminum, 0.7-0.8 part of boron trifluoride ethyl ether, 2-3 parts of a wood powder, 20-30 parts of 30% sodium hydroxide solution, 20-30 parts of an 30-percent ethanol solution, 0.5-0.7 part of a nanometer far-infrared ceramic powder and an appropriate amount of water. According to the material provided by the invention, the wood powder is treated with alkaline liquor and ethanol, so that the wood powder has good lubrication property and dispersity, is rich in void, adsorbs the nanometer far-infrared ceramic powder, and improves the dielectric properties, heat resistance and toughness of a circuit board.

Description

technical field [0001] The invention relates to the technical field of printed circuit board prepregs, in particular to an epoxy resin glass fiber cloth composite printed circuit board material with good dielectric properties and a preparation method thereof. Background technique [0002] Printed circuit boards are the main components in electronic products, and their quality and reliability are crucial to electronic products. Epoxy prepreg (Epoxy Prepreg) is currently the main raw material for the production of printed circuit boards. Storage aging will have a significant impact on the performance of epoxy prepreg, and then affect the quality of printed circuit boards. The moisture and heat aging resistance of printed circuit boards directly affects the reliability of electronic products, and it is of great significance to characterize and improve the moisture and heat aging resistance of printed circuit boards for the electronics industry. In this paper, by combining a v...

AI Technical Summary

Problems solved by technology

[0003] The water resistance of the printed circuit board obtained in the article "Storage Aging of Epoxy Prepreg and Humidity and Heat Aging of Printed Circuit Board" has been improved, but the epoxy resin is brittle and has poor adhesion to the glass surface. Vibration will peel off and affect the stability of the circuit board, which needs to be improved, and the dielectric properties of the circuit board also need to be improved