Epoxy resin glass cloth composite printed circuit board material with good heat dispersion property and preparation method thereof

Abstract

The invention discloses an epoxy resin glass cloth composite printed circuit board material with a good heat dispersion property and a preparation method thereof. The epoxy resin glass cloth composite printed circuit board material is prepared from, by weight, 32-34 parts of 1080 glass fiber cloth, 40-42 parts of E-51 epoxy resin, 29-30 parts of phenolic resin, 0.3-0.4 parts of 4-ethylimidazole, 20-22 parts of carbon nano tube, 2.3-2.6 parts of vinylidene fluoride-hexafluoropropylene copolymer, 25-30 parts of butadiene, a proper amount of hydrogenated gasoline, 0.01-0.02 part of nickel naphthenate, 0.4-0.5 part of triisobutyl aluminium, 0.7-0.8 part of boron trifluoride diethyl etherate, 2.3-2.6 parts of expanded graphite powder, 2.5-2.8 parts of aromatic polyurethane acrylate and 0.8-1 parts of diamond micro-powder. By using the expanded graphite powder and the diamond micro-powder, the abrasive resistance and heat dispersion property of the material are improved, aromatic polyurethane acrylate is used for sealing and forms a chemical bond with the epoxy resin, the strength of the material is improved and the dielectric property is not affected.

Description

technical field [0001] The invention relates to the technical field of printed circuit board prepregs, in particular to an epoxy resin glass fiber cloth composite printed circuit board material with good heat dissipation and a preparation method thereof. Background technique [0002] Printed circuit boards are the main components in electronic products, and their quality and reliability are crucial to electronic products. Epoxy prepreg (Epoxy Prepreg) is currently the main raw material for the production of printed circuit boards. Storage aging will have a significant impact on the performance of epoxy prepreg, and then affect the quality of printed circuit boards. The moisture and heat aging resistance of printed circuit boards directly affects the reliability of electronic products, and it is of great significance to characterize and improve the moisture and heat aging resistance of printed circuit boards for the electronics industry. In this paper, by combining a variet...

AI Technical Summary

Problems solved by technology

[0003] The water resistance of the printed circuit board obtained in the article "Storage Aging of Epoxy Prepreg and Humidity and Heat Aging of Printed Circuit Board" has been improved, but the epoxy resin is brittle and has poor adhesion to the glass surface. Vibration will peel off and affect the stability of the circuit board. It needs to be improved, and the heat dissipation of the circuit board needs to be improved