A kind of epoxy-based potting glue for PVDF ultrafiltration membrane module end sealing and preparation method thereof
An epoxy-based, ultrafiltration membrane technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of epoxy glue burning film discoloration, cracking and shelling, and high exothermic temperature
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Embodiment 1
[0050] Epoxy resin component A raw material parts by weight:
[0051]
[0052] Denatured aromatic aliphatic amine raw material parts by weight:
[0053]
[0054] Curing agent component B raw material parts by weight:
[0055]
[0056] Preparation:
[0057] Preparation of epoxy resin component A:
[0058] According to the weight percentage of raw materials, first add epoxy resin, active toughening agent, active diluent, and functional additives into the reactor in sequence, keep stirring and mixing in the temperature range of 25°C-75°C for 3-6h, turn off the stirring and let it stand , to prepare epoxy resin component A, and put the discharged material into a sealable container for room temperature storage.
[0059] Preparation of denatured aromatic aliphatic amines:
[0060] According to the weight percentage of raw materials, add m-xylylenediamine and catalyst into reactor I in advance, stir and mix for 0.5-1.5h and raise the temperature to 45°C-50°C for later us...
Embodiment 2
[0067] Epoxy resin component A raw material parts by weight:
[0068]
[0069] Denatured aromatic aliphatic amine raw material parts by weight:
[0070]
[0071] Curing agent component B raw material parts by weight:
[0072]
[0073]
[0074] The mixing weight ratio of epoxy resin component A and curing agent component B is 100:45.
Embodiment 3
[0076] Epoxy resin component A raw material parts by weight:
[0077]
[0078] Denatured aromatic aliphatic amine raw material parts by weight:
[0079]
[0080] Curing agent component B raw material parts by weight:
[0081]
[0082] The mixing weight ratio of epoxy resin component A and curing agent component B is 100:50.
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