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A profiling jet device for preventing missing plating in positioning holes on electroplated parts and its application

A jet device and positioning hole technology, applied in the field of electroplating auxiliary devices, can solve the problems of poor electrical conductivity of non-metallic surfaces, low current density at the positioning hole, lack of metal nickel ions, etc., to achieve high energy utilization and avoid missing plating Phenomenon, improvement of nickel ions and uneven distribution of current density

Inactive Publication Date: 2018-10-30
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional non-metallic nickel plating method, the electrical conductivity of the non-metallic surface is poor. For positioning holes with small diameter and large depth, the electroplated parts are prone to block the flow of plating solution at the positioning hole, lack of metal nickel ions, and the positioning hole The current density at the position is too small and uneven, resulting in missing plating at the positioning hole

Method used

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  • A profiling jet device for preventing missing plating in positioning holes on electroplated parts and its application
  • A profiling jet device for preventing missing plating in positioning holes on electroplated parts and its application

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0019] Example 1 combined figure 1 The configuration of the present invention will be described.

[0020] figure 1 The structure of the profiling fluidic device for preventing missing plating of positioning holes is given, figure 1 Among them, 1 is a non-metallic electroplating part, specifically a non-metallic slush mold for an automobile instrument panel, 3 is a positioning hole opened on a non-metal slush mold for an automobile instrument panel, 4 is a profiling auxiliary jet channel, and 5 is a hole, Open on the profiling auxiliary jet channel 4, and 2 is a circulation pump. The profiling auxiliary jet channel 4, the hole 5 and the circulating pump 2 constitute the profiling jet device as the main structures.

[0021] combine figure 1 The structure of the present invention is further described. The profiling jet device includes a profiling auxiliary jet channel 4 and a bracket matched with the non-metallic electroplating part 1, and the profiling auxiliary jet device ...

Embodiment 2

[0024] Example 2 combined figure 2 Describe the working process of the profiling jet device.

[0025] First, the holes 5 of the profiling auxiliary jet channel 4 are placed one by one on the positioning hole 3 on the non-metallic electroplating piece 1, so that the axis of the hole 5 is on the same line as the axis of the positioning hole 3, so that the direction of the auxiliary jet flow of the plating solution is in line with that of the positioning hole 3. The bottom of the positioning hole 3 of the non-metallic plating part is vertical.

[0026] There is a certain distance between the profiling auxiliary jet channel 4 and the non-metallic electroplating part 1. If the distance is too small, the nickel ions circulate at the positioning hole 3 quickly, and the contact time of the plating part is short, making plating difficult; if the distance is too large, the jet effect is weak , There is a dead angle of circulation at the positioning hole 3, and the nickel ions cannot b...

Embodiment 3

[0028] Example 3 A profiling jet device for preventing missing plating in the positioning holes of the slush molding mold of an automobile instrument panel and an electroplating method for the positioning holes.

[0029] The profiling auxiliary jet channel 4 in the profiling auxiliary jet device keeps a certain distance from the non-metallic electroplating part 1, and makes each positioning hole 3 correspond to the center of the hole 5 one by one. As far as the slush mold of the automobile instrument panel is concerned, the diameter of the positioning hole 3 of the non-metallic electroplating part is 12 mm, and the depth is 10 mm. The diameter of the hole 5 on the profiling auxiliary jet channel 4 is 8 mm. Jet channel 4 bath flow rate is 0-12m 3 / h (circulation pump 2 rated bath flow rate 12m 3 / h, head 18m).

[0030] In the specific implementation, the profiling auxiliary jet channel 4 is 10cm away from the non-metallic electroplating piece 1, and the plating solution flow ...

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Abstract

The invention belongs to the technical field of electroplating auxiliary devices, and relates to a profiling fluidic device for preventing skip plating of locating holes in an electroplated part and application of the profiling fluidic device. According to the structure, a profiling auxiliary fluidic channel (4) fixed to a profiling support is arranged, holes (5) are formed in the profiling auxiliary fluidic channel (4) in the manner of being in one-to-one correspondence to the centers of the locating holes (3) in the nonmetal electroplated part (1), and the middle of the profiling auxiliary fluidic channel (4) is connected with a circulation pump (2). The profiling fluidic device can be used for locating holes in an automobile instrument board slush molding die, metal nickel ion circulation supplement is continuously carried out on the locating holes during work, and the skip plating phenomenon is prevented from happening to nickel plating of the locating holes; and the structure is simple, operation is easy and convenient, cost is low, and the energy utilization rate is high.

Description

technical field [0001] The invention belongs to the technical field of electroplating auxiliary devices, and in particular relates to a profiling jet flow device and an electroplating method for positioning holes for preventing missing plating in positioning holes of slush molding molds on automobile instrument panels. Background technique [0002] The electroplating process is widely used today, and it is applied to nickel plating of non-metallic electroplated parts in many fields. There are many factors that affect the quality of the coating of non-metallic electroplated parts, such as current density, distribution of metal cations, bath temperature and cathode moving speed, etc. . In the traditional non-metallic nickel plating method, the electrical conductivity of the non-metallic surface is poor. For positioning holes with small diameter and large depth, the electroplated parts are prone to block the flow of plating solution at the positioning hole, lack of metal nickel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/08C25D5/02C25D5/06
CPCC25D5/022C25D5/026C25D5/06C25D5/08
Inventor 姚卫国安立佳窦艳丽管东波李宏飞卢宇源鲁姗姗王瀚墨王晓伟
Owner JILIN UNIV