Activation solution for electroless plating of non-conductive substrate and preparation method thereof

An activation solution and non-conductive technology, which is applied in liquid chemical plating, printed circuit manufacturing, printed circuit, etc., can solve the problems of insufficient adhesion between the chemical plating layer and the substrate, uneven coverage, missing plating, etc., and can be applied to a wide range of plate types performance, good backlight, and uniform thickness

Active Publication Date: 2020-11-17
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional ionic palladium activation process, because palladium ions cannot cover certain materials uniformly and effectively, missing plating occurs, resulting in insufficient adhesion between the final electroless plating layer and the substrate.

Method used

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  • Activation solution for electroless plating of non-conductive substrate and preparation method thereof
  • Activation solution for electroless plating of non-conductive substrate and preparation method thereof
  • Activation solution for electroless plating of non-conductive substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-7

[0059] Referring to the general synthesis method of polymer modifiers, each polymer modifier 1-7 was prepared according to the ingredients listed in Table 1, the structure of each monomer and the number of repeating units.

[0060] Table 1

[0061]

[0062]

[0063] Wherein, the preparation method of polymer regulator in embodiment 1 comprises the steps:

[0064] Add 1 part of isobutanol into the stainless steel reaction kettle, and pass in nitrogen gas. After the oxygen content in the kettle is less than 100ppm, add an appropriate amount of potassium hydroxide in a closed manner, raise the temperature to 80°C, continue to pass in nitrogen to pressurize, and raise the temperature to 110°C, and the pressure is 0.3 MPa, continuously add 10 parts of propylene oxide, react for 12 hours, lower the temperature, dehydrate, and the obtained intermediate product is directly used for the subsequent reaction.

[0065] Add an appropriate amount of potassium hydroxide to the reactio...

Embodiment 8

[0069] Preparation of activation solution: 150mg of palladium chloride (calculated as palladium ion concentration) and 250mg of acetylacetone were dissolved in 1L of deionized water, then 75mg of the polymer regulator prepared in Example 1 was added and fully stirred to dissolve, and finally 8.4g / L of aqueous sodium bicarbonate solution to adjust the pH to 7.5.

[0070] Electroless copper plating: The glass fiber through-hole plate with a thickness of 2.5mm and an aperture ratio of 10:1 is firstly subjected to expansion, degumming, neutralization, degreasing, micro-etching, and pre-dipping operations in sequence according to the conventional copper deposition process, and then At room temperature, immerse in the palladium activation solution obtained above for 60 seconds, and finally treat it with 0.1% sodium borohydride aqueous solution for 40 seconds for reduction. EDTA disodium salt, 15mg / L formaldehyde and 13g / L sodium hydroxide in the electroless copper plating solution,...

Embodiment 9

[0072] Preparation of activation solution: 300mg of palladium chloride (calculated as palladium ion concentration) and 450mg of acetylsalicylic acid were dissolved in 1L of deionized water, then 100mg of the polymer regulator prepared in Example 2 was added and fully stirred to dissolve, and finally 3.6 g / L aqueous potassium hydroxide solution to adjust the pH to 12, and place the solution in a water bath at 45°C for later use.

[0073] Electroless copper plating: The resin through-hole plate with a thickness of 2.5mm and an aperture ratio of 10:1 is firstly subjected to expansion, degumming, neutralization, degreasing, microetching, and pre-dipping operations in sequence according to the conventional copper plating process, and then immersed in In the above-mentioned palladium activation solution for 15 seconds, then through the same reduction and electroless copper plating process as in Example 8, copper plating is completed.

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Abstract

The invention relates to an activator for chemical plating of a non-conductive base material. The activator is prepared from a solvent and the following raw materials of soluble transition metal salt,a complexing agent, a polymer regulator and an alkaline pH value regulator, and the structural formula of the polymer regulator is shown in the specification, wherein R1 is selected from C3-C16 alkylor alkenyl, R2, R3 and R4 are separately selected from C2-C6 alkyl, a is equal to 0-10, b is equal to 0-10, c is equal to 0-10, and a, b and c are integers and are not equal to 0 at the same time. The non-conductive base material treated by the activator has the advantages that the adhesive force between a chemical plating layer and the surface of the non-conductive base material is improved, theplating thickness can be uniform, the backlight is good, skip plating can be prevented, and good electrical interconnection of circuit boards is guaranteed.

Description

technical field [0001] The invention relates to the field of PCB circuit board preparation, in particular to an activation solution for electroless plating of non-conductive substrates and a preparation method thereof. Background technique [0002] In the production process of a printed circuit board (Printed Circuit Board, PCB), after the board is drilled, an electroless plating process is required to achieve surface metallization of the non-conductive substrate therein. During the electroless plating process, a certain amount of catalytic active centers need to be adsorbed on the non-metallic substrate to induce subsequent electroless plating. The catalytic active centers commonly used in the PCB industry are mainly transition metals such as palladium, silver, copper, nickel, iron or cobalt, among which palladium is the most commonly used. The existing palladium activator products mainly include colloidal palladium and ionic palladium. The stability and service life of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/30H05K3/18
CPCC23C18/1882C23C18/28H05K3/181
Inventor 李龙斌黄远提李卫明宋兴文
Owner GUANGDONG TONESET SCI & TECH
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