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Method and system for measuring radiation and temperature exposure of wafers along a manufacturing process line

A radiation intensity, chip technology, applied in the field of ultraviolet light and temperature exposure, can solve the problem of simultaneous monitoring of UV radiation intensity and temperature

Active Publication Date: 2021-01-08
KLA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current methods cannot simultaneously monitor both UV radiation intensity and temperature under the extreme conditions (eg, high temperature and short wavelength) required by current processing techniques

Method used

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  • Method and system for measuring radiation and temperature exposure of wafers along a manufacturing process line
  • Method and system for measuring radiation and temperature exposure of wafers along a manufacturing process line
  • Method and system for measuring radiation and temperature exposure of wafers along a manufacturing process line

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Embodiment Construction

[0024] Reference will now be made in detail to the disclosed subject matter which is illustrated in the accompanying drawings.

[0025] generally refer to Figures 1A to 2 , systems and methods for measuring radiation intensity and / or temperature are described according to the present invention.

[0026] Figure 1A A conceptual diagram illustrating a cross-section of a measurement wafer device 100 for measuring radiation and / or temperature at one or more locations throughout a wafer device in accordance with one or more embodiments of the present invention.

[0027] In one embodiment, wafer metrology apparatus 100 includes wafer assembly 102 . In another embodiment, the die assembly 102 includes one or more cavities 104 . One or more cavities 104 may be formed by any process known in the semiconductor manufacturing arts, such as grinding, chemical etching, laser etching, and the like. In another embodiment, wafer measurement apparatus 100 includes detector assembly 103 disp...

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Abstract

A measuring wafer device for measuring radiation intensity and temperature comprises a wafer assembly comprising one or more cavities. The gauge wafer arrangement further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on the surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.

Description

[0001] Cross References to Related Applications [0002] This application relates to and claims benefit from the earliest available effective filing date (e.g., claiming the earliest available priority date other than a Provisional Patent Application or under 35 USC § 119( e) claim rights to the provisional patent application, to any and all parent, grandparent, great-grandparent, etc. applications of related applications). [0003] Related applications: [0004] For purposes of USPTO non-statutory requirements, this application constitutes Mei Sun, Earl Jensen, and Kevin O' Full (non-provisional) patent of US provisional patent application titled WIRELESS UV AND TEMPERATURE SENSING DEVICE FOR HIGH TEMPERATURE PROCESS in which Kevin O'Brien is the inventor application case. technical field [0005] The present invention relates generally to radiation and temperature monitoring of wafers along semiconductor process lines, and in particular, the present invention relates to m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67G01J5/10G01J5/08G01J5/04G01J1/58G01J1/42G01J1/04G01J1/02H01L21/66
CPCG01J1/0204G01J1/0271G01J1/0407G01J1/429G01J1/58G01J5/04G01J5/0818G01J5/10H01L21/67248H01L21/67253H01L22/10G01K11/20
Inventor 梅·孙厄尔·詹森凯文·奥布赖恩
Owner KLA CORP