Ladder-free heat conduction LED lamp likely to dissipate heat

Abstract

The invention discloses a ladder-free heat conduction LED lamp likely to dissipate heat. The ladder-free heat conduction LED lamp comprises an aluminum lamp base, a heat dissipation piece and an LED heat source. The aluminum lamp base and the heat dissipation piece are of an integrated structure. The LED heat source makes tight contact with the heat dissipation piece. In the ladder-free heat conduction LED lamp, the heat dissipation piece and the aluminum lamp base are of the integrated structure, integrated forming is achieved in a continuous pressure casting forming manner, fusion of the grain boundary at the interface position is achieved, gas and bubbles are prevented from being generated at the interface position in the actual using process, the heat dissipation effect is good, and reliability is high. The integrated structure can effectively resist shock, is high in reliability and flexible in usage and is not influenced by gravity in the transporting process. The technology is simple, repeatability is high, the qualification rate is high, and cost is greatly reduced. When the ladder-free heat conduction LED lamp likely to dissipate heat is used, the temperature is continuously distributed from the center area of the LED lamp to the edge area. In the using process, the real-time performance is achieved in the heat dissipation process, heat conduction is good, and the heat dissipation effect is obviously superior to that of a traditional LED lamp.

Description

technical field [0001] The invention relates to the technical field of lighting, in particular to an LED lamp with no step-wise heat conduction and easy heat dissipation. Background technique [0002] The life of the LED heat source is closely related to the temperature in the heat source cavity during its use. Experience shows that for every 10°C decrease in temperature, the life of the LED heat source can be extended twice, so the heat dissipation of the LED is a very important link in the LED design process. Aluminum is a typical material for the base of LED lamps, but the thermal conductivity of aluminum is 237W / m·K, the thermal conductivity is insufficient, and the heat dissipation efficiency is slow. Copper is a material with excellent thermal conductivity, and its thermal conductivity is 401W / m·K, which is significantly better than that of aluminum, which is 237W / m·K. Copper-aluminum composite is a common way for LED lamps to dissipate heat. The existing copper-alum...

AI Technical Summary

Problems solved by technology

However, this method has the following disadvantages: (1) The requirements for the flatness of the surface of copper and aluminum materials are high, and the processing cost is increased; (2) Stress will be generated in the crimping area; There is a temperature difference on the side, the temperature of the copper is higher, and the temperature of the aluminum is lower

Under the combined effect of stress and temperature difference, gaps will be formed in the crimping area, and air will seep into the gap area-the existence of air will have a heat insulation effect, resulting in a decrease in heat conduction function, which will cause the lamp to fail rapidly; (3) LED heat source and There is a temperature difference between the aluminum substrates, that is, the temperature of the LED heat source is the highest, followed by the temperature of the copper material, and the temperature of the aluminum substrate is the lowest. The temperature from the LED heat source to the edge of the lamp is distributed in a ladder shape, resulting in non-instant heat dissipation, insufficient heat conduction, and unsatisfactory heat dissipation effect.

[0003] Patent CN 203202985U proposes a composite method of filling the interface of copper and aluminum with low-melting point metal to realize heat dissipation, but this method has complex process, low pass rate, high cost, and bubbles are easy to be generated during use, which is harmful to heat dissipation. adverse effect on the process

[0004] In addition, in traditional LED lamps, the LED heat source and the copper heat sink are mostly bonded by thermal conductive silicone grease. This method has two disadvantages: (1) The thermal conductive silicone grease is easy to cure after a long time (2) The thermal conductivity of the thermal conductive silicone grease The conductivity value is only 401W / m·K, the heat conduction is very poor, and the heat dissipation is very slow

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