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GaN-based vertical transistor and preparation method thereof

A technology of vertical transistors and epitaxial layers, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as limited breakdown voltage, achieve high reverse breakdown voltage, best turn-off effect, reduce reverse The effect of leakage current

Inactive Publication Date: 2017-06-13
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But it also has some unsolvable problems, such as limited breakdown voltage, etc.

Method used

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  • GaN-based vertical transistor and preparation method thereof
  • GaN-based vertical transistor and preparation method thereof
  • GaN-based vertical transistor and preparation method thereof

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Embodiment Construction

[0045] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. It should be understood that the specific The examples are only used to explain the present invention, not to limit the present invention. The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] figure 1 is a structural schematic diagram of Embodiment 1 of a GaN-based vertical transistor. Such as figure 1 As shown, the GaN-based vertical transistor includes: an n-type GaN substrate 100, preferably with a thickness of 300...

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Abstract

The invention discloses a GaN-based vertical transistor and a preparation method thereof. The GaN-based vertical transistor comprises an n type GaN substrate, an n type GaN epitaxial layer, a first p type GaN epitaxial layer, a groove, a gate region epitaxial laminated layer, a gate electrode, source electrodes and a drain electrode. The n type GaN substrate has first doping concentration; the n type GaN epitaxial layer has second doping concentration and is formed on the n type GaN substrate, and the second doping concentration is smaller than the first doping concentration. The first p type GaN epitaxial layer is located on the n type GaN epitaxial layer; the groove penetrates through the p type GaN epitaxial layer and extends into the n type GaN epitaxial layer; the gate region epitaxial laminated layer is formed in the groove and extends towards the two sides, and sequentially comprises a GaN epitaxial layer, a AlGaN epitaxial layer and a second p type GaN epitaxial layer from bottom to top. The gate electrode is formed at the position, in the groove, of the gate region epitaxial laminated layer; the source electrodes are located on the first p type GaN epitaxial layer and formed on the two sides of the gate region epitaxial laminated layer in the mode that a certain interval is kept between the source electrodes and the second p type GaN epitaxial layer. The drain electrode is located on the back face of the n type GaN substrate.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a GaN-based vertical transistor and a preparation method thereof. Background technique [0002] With the rapid development of information technology, high-power electronic devices such as power switches and power rectifiers have been widely used in various fields of the national economy. As a substitute for traditional silicon-based power devices, power devices based on the third-generation wide-bandgap semiconductor GaN materials have attracted much attention due to their excellent material properties and device structures. GaN material has a large band gap and electron mobility, good thermal stability and chemical stability, so it has a wide application prospect in the field of high power and high frequency, and has attracted attention and research. GaN power transistors are popular candidates for power conversion system applications due to their high efficiency and small size. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L21/336H01L29/06
CPCH01L29/0619H01L29/0638H01L29/66666H01L29/7827
Inventor 陈琳郑亮戴亚伟孙清清张卫
Owner FUDAN UNIV