Packaging structure of display module and preparation method thereof

A display module and packaging structure technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of display devices not working properly, display module 12 damage, display module 12 erosion, etc. Achieve the effects of increasing the quantity, improving the packaging effect, and inhibiting the peeling off of the film layer

Active Publication Date: 2017-06-13
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the characteristics of the glass glue 13 itself and defects such as gaps between the cover glass 14 and the array substrate 11, the figure 1 The mechanical strength of the packaging structure shown in is weak, and it is easy to be damaged when encountering external impact, especially in the service life test, the above-mentioned packaging structure is very easy to produce gaps, so that the destructive gas in the external environment can invade into the In the packaging structure, the above-mentioned display module 12 is corroded, and even directly causes the display module 12 to be damaged when external impact occurs, thereby causing the display device to fail to work normally.

Method used

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  • Packaging structure of display module and preparation method thereof
  • Packaging structure of display module and preparation method thereof
  • Packaging structure of display module and preparation method thereof

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Embodiment 1

[0072] Figure 2-5 It is a schematic flow diagram for preparing the packaging structure of the display module in the embodiment of the present application; as Figure 2-5 As shown, the present application provides a method for preparing a display module packaging structure, which may include the following steps:

[0073] First, if figure 1 As shown, an array (array) process of display devices is performed on the basis of a base substrate (such as a Low Temperature Polysilicon (LTPS) substrate) to form an array substrate 21; the above-mentioned array substrate 21 can be set In the display area and the non-display area set adjacent to the display area, the array substrate 21 in the display area is mainly used for the attachment and preparation of display devices; at the same time, a thin film can also be arranged on or in the array substrate 21 The transistor display circuit is used to drive the subsequent display module to work.

[0074] In addition, during the above-mention...

Embodiment 2

[0089] Can be based on the basis of the first embodiment above, such as Figure 5 As shown, the embodiment of the present application also provides a display module packaging structure, and the display module packaging structure can be used to prepare various display devices (such as OLED display devices, etc.), the above-mentioned display module packaging structure includes:

[0090] The array substrate 21 can be a substrate for completing the array (array) process, and can include but not limited to an LTPS substrate, etc.; the array substrate 21 can have a front surface for setting devices (i.e. Figure 5 shown in the upper surface) and the lower surface relative to the upper surface (ie Figure 5 The lower surface shown in ); the material of the substrate can be selected as glass, and the array substrate 21 can also be formed with a hard substrate or a flexible substrate, and the array substrate 21 can be provided with a device for driving a display module. Light-emitting...

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Abstract

The invention discloses a packaging structure of a display module and a preparation method thereof, relates to the technical field of display devices, and can be used for preparing display devices such as an AMOLED. The packaging structure of the display module and the preparation method thereof mainly sealedly protect the display module by a film packaging structure, namely, seal the display module by an inorganic film layer having a water oxygen prevention characteristic and transparency, and buffer the internal and external stresses of the film layer by preparing an organic module outside the inorganic film layer. When a flexible device is made, the film layer can be prevented from falling off due to the bending stress. Meanwhile, a bulge structure formed by multilayer stacking can effectively suppress the diffusion effect of an inorganic layer coating and increase the number of side water retaining walls of a film device, thereby effectively improving the packaging effect. The bulge structure supports a metal mask plate in the coating procedure and prevents damage to a substrate surface pattern. Additionally, the mechanical strength of the whole display device is effectively improved by using film packaging instead of glass Frit glue packaging technology.

Description

technical field [0001] The invention relates to the technical field of display devices, in particular to a packaging structure of a display module and a preparation method thereof. Background technique [0002] In the display devices of electronic equipment, display electronic devices such as electrodeless light-emitting diodes (LEDs) or organic light-emitting diodes (OLEDs) used to generate light sources are key devices for the normal operation of display devices, but the above-mentioned electronic devices are extremely vulnerable The corrosion of moisture and oxygen in the external environment, so in order to ensure the normal operation of electronic devices, it is necessary to isolate and protect the display electronic devices. [0003] At present, glass glue (Frit) is mainly used to fix the cover glass on the array substrate, so as to seal the display electronic devices arranged on the array substrate; figure 1 As shown, in the traditional packaging structure of display...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8426H10K50/84H10K71/00
Inventor 何信儒吴建霖江欢
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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